INTELLICONNECT MOVES TO LARGER FACTORY AS SALES GROW I


ntelliconnect (Europe) Ltd. has moved to a larger facility at the


Corby Innovation Hub following sales growth of 30% in 2020. The move to a 6400ft² site provides the space required for their immediate increase in production requirements and provides additional space for future expansion. Despite enormous supply chain,


delivery and logistics challenges during 2020 Intelliconnect has introduced a number of key new


products including high density connector blocks and high specification cable products and capitalised on a number of significant opportunities in cryogenic, defence, medical and marine applications worldwide. Growth markets include wireless communications, the IoT and Industry 4.0, quantum computing and research. Intelliconnect also made a


number of strategic investments


during 2020 with the appointment of a Global Sales and Marketing Director to oversee sales and marketing across all of Intelliconnect’s markets with their business partners around the world. And a UK Sales Manager, to lead management and business development of sales for the UK and Ireland with special emphasis on medical, industrial, test and measurement and cryogenic markets. www.intelliconnect.co.uk


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LMD’S SENSOR ADDS VITAL STATISTICS MEASUREMENT TO WEARABLES


Leman Micro Devices will see its V-Sensor launched onto the market in 2021 as part of the latest


generation of smartphones, wearables and mobile devices that measure blood pressure, blood oxygen (Sp02), respiration rate, pulse rate, and body temperature – to medical accuracy,


completely cuff-less and calibration free; with no other devices needed. Results are delivered in LMD’s e-Checkup app. V-Sensor now brings the measurement of vital signs for


personal health to the same devices. Bundled with a phone, V- Sensor and e-Checkup are effectively free to the consumer, in the same way as a phone camera. Developed over the last nine years, the V-Sensor is a tiny


module with a fingertip-shaped depression on its surface, containing a MEMs pressure sensor embedded in flexible resin. The V-Sensor also contains an optical sensor, a temperature sensor and LMD’s custom Application Specific Integrated Circuit (ASIC) which conditions and digitises the signals from the sensors and drives the LEDs and communication. www.leman-micro.com


HIGH FREQUENCY CHIP EQUALIZERS A


s 2021 kicks off with more of the same as 2020, as


lockdown still continues, we bring you the best of the electronics sector’s current innovations. In this issue don’t miss the latest forecast from ecsn and what lays ahead for the coming months. you will also find some great tech focuses, such as Power Integrations, views on how to reduce the size of high efficiency chargers in today’s space constrained small footprint devices on p6. In our enclosures special we feature some of the latest top products from p12. Plus lots more, from IoT, interconnection and power electronics and more. Michelle Winny Editor


4 DECEMBER/JANUARY 2021 | ELECTRONICS


pushing the boundaries of size, weight and power with each new design and expanding our offering for Space, Defence and Communication systems”, says Bruce Valentine, VP of Business Development. This range is a totally passive


Smiths Interconnect’s new CEX Series of High Frequency Surface Mount Chip Equalizers are optimised to offer precise compensation for unwanted gain variation over frequency in an RF signal chain. These devices offer a configurable


design approach to get the right solution for specific frequency range and slope, fitting a wide variety of requirements up to 40GHz with a maximum slope of 4dB. “The CEX series of chip equalizers


complements our existing line of SMT high frequency board level components,


solution with multiple slope and band options allowing RF designers to reach more precise compensation as the series offers linear gain equalizers with a positive slope. Multiple slope options are offered


from (1-4 dB) and excellent slope linearity (±0.25 dB or better). Typical Voltage Standing Wave Ratio


is 1.5:1 max and low insertion loss at 1 – 1.25 dB max. Frequency offering is up to 40GHz


supporting a wide array of markets and applications. Proven thin and thick film process


technology provides small size, light- weight and level of power in a cost- effective, easy-to-implement surface mount solution. www.smithsinterconnect.com


Nexperia’s new 80V RET (Resistor- Equipped Transistor) family are ‘digital transistors’ that provide enough headroom for use in 48V automotive board net (e.g. mild hybrid and EV cars) and other higher voltage circuits, which are often subject to large spikes and pulses that previous 50V parts cannot handle. RETs combine the bias resistor and bias- emitter resistor in the same SOT23 (250 mW Ptot) or SOT323 (235 mW Ptot) package as the transistor. Double RETs (two transistors and two matching bias resistors and bias- emitter resistors) are also available in the SOT363 package with a Ptot of 350 mW for even greater integration and savings.


www.nexperia.com/RETs


Farnell has launched a new ebook: “The Industry 4.0 Interviews 2020”. This ebook features the views of global experts from Festo, Omega, Molex, Pansonic and Scheider Electric on the development of the Industrial Internet of Things (IIoT) and related technologies. The ebook provides insights for panel builders, systems integrators and designers, industrial and electronic engineers, including those involved in maintenance and repair.


www.farnell.com


Altus is partnering with Heller Industries and Asscon. As electronic products continue to become smaller, more advanced and complex in construction, soldering performance and thermal consistency in production are more of a challenge. The addition of Heller Industries and Asscon will strengthen Altus’ existing portfolio of equipment for the electronics industry and provide customers with technology to ensure PCBA manufacturing can run efficiently with the best soldering performance across their applications.


www.altusgroup.co.uk


/ ELECTRONICS


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