ADVERTORIAL TECHNOLOGY IN ACTION


and existing products. Based in Newbury, Berkshire, we are a specialist PCB assembly manufacturer, focusing on prototyping design as


EMS - Electronic Manufacturing Solutions E


New Additions to the


ODU-Mac® Range from Selwyn Electronics


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he ODU-MAC® modular range of connectors continues to grow with the addition of the Push-Lock and Zero


variations. The ODU-Mac® Push-lock offers a compact, sealed


housing with push-locking based on the ODU-MAC® Blue- Line series. Seven units can be custom fitted with hybrid connector configurations offering IP67 protection. A total of six optional coding functions and the tried-and-tested push-pull locking principle ensure mating is reliable and secure, which has been achieved from the decades of experience obtained through ODU push-pull circular connectors. The ODU-Mac® Zero with its symmetrical housing,


enables a range of up to 9 units of signal, power, data-rate and coax modules. In place of an aluminium frame, the plastic housing parts have integrated rails, making the use of magnetic components no longer necessary. 90˚,45˚and straight cable exit connector housings with a slimline, light designed receptacle for easy handling. See our website for further details.


Selwyn u 01732 765100 u interconnect@selwyn.co.uk u www.selwyn.co.uk


dedicated to delivering a reliable, best-in-class service that exceeds customer expectations and keeps them coming back time and time again. Most of our customers come to us through word of mouth, and three of our biggest customers have even been working with us in excess of a decade!


Electronic Manufacturing Solutions Ltd u 01635 588 871 u sales@emsolutions.uk.com


RTI Introduces Xcelerators: Professional Services Expertise for Developing Autonomous Systems


deploying complex distributed systems. Customers can use Xcelerators to maximize development efficiency, eliminate costly rework and accelerate project success. The Xcelerators can be customized, based on project phase, to provide specific use-case design guidance combined with deep product expertise to enable developers to hit critical project milestones. Xcelerators are a new way for customers to maximize the value they


R


receive from their support plans by leveraging the Services team’s expertise in optimizing the design of their RTI Connext® DDS-based systems. Customers can filter the Xcelerators catalog by project stage including research, product development, integra-


tion and testing, production, proof of concept, and more. They can also filter the Xcelerators by service type. The Xcelerators catalog will continue to expand as RTI adds offerings to meet future customer requirements.


RTI


Two New Gen 3 PXI Express (PXIe) Chassis P


u +1 (408) 990-7400 u www.rti.com


TI Xcelerators™ from Real-Time Innovations is a new program to pro- vide customers access to expertise in architecting, developing and


well as large-volume assembly projects. We have in the last couple of years invested £1 million in a new line of PCBA equipment, which includes the latest surface-mount technology. Our team sees projects through from start to finish and is


MS is well-established in the UK as a global supplier of electronic manufacturing services including printed circuit board assembly (PCBA), full turnkey solutions and cable assembly. We also provide design support for new


ickering Interfaces, the leading supplier of modular signal switching and simulation solutions for use in electronic test


and verification, today launched new 8- and 18-slot Gen 3 PXIe chassis designed for high-performance, benchtop or rack- mount applications. Both chassis feature an intelligent chassis management system that monitors the power supply voltage, internal temperature and cooling fan speed. Pickering’s 42-924 8-slot chassis provides seven hybrid-com-


patible slots for application flexibility. The 42-925 18-slot chas- sis provides one PXIe system slot, one PXIe timing slot and 16


hybrid-compatible slots for similar versatility. Any 3U PXI, PXIe, or Compact PCI-compliant module will work in any module slot. The 4U high chassis also benefit from high-capacity system power supplies rated at 400W (8-slot) and 1200W (18-


slot). Efficient fans and a direct convection design ensure maximum PXI module cooling, enabling the chassis to oper- ate over an extended ambient temperature range of 0°C to +50°C.


Pickering Interfaces u 01255 687900 u www.pickeringtest.com


generation in its successful line of secure control FPGAs. Building on the capabilities of the Lattice MachXO3D™ family announced in 2019, Mach-NX FPGAs deliver heightened security features and the fast, power-efficient processing needed to implement a real-time Hardware Root-of-Trust (HRoT) on future server platforms, as well as computing, communications, industrial, and automotive systems. Mach-NX marks the third FPGA family developed on the Lattice Nexus™ FPGA platform in a year. “The race is on between bad actors trying to exploit firmware vulnerabilities and developers designing server


Security Solution with New Mach-NX FPGA L


attice Semiconductor Corporation, the low power programmable leader, announced the Lattice Mach™-NX FPGA family, the second


platforms with the security features and performance to stop them. Protecting systems requires a real-time HRoT with support for stronger cryptography algorithms like ECC 384 and new, robust data security protocols like SPDM.’’ said Patrick Moorhead, president and founder of Moor Insights & Strategy.”


Lattice Semiconductor Corporation u For more information about Lattice, please visit www.latticesemi.com. You can also follow us via LinkedIn, Twitter, Facebook, YouTube, WeChat, Weibo or Youku.


38 DECEMBER/JANUARY 2021 | ELECTRONICS


Smiths Interconnect Pushes Performance in Wafer Testing Solutions


S


miths Interconnect, a leading provider of innovative solutions for critical semiconductor test applications,


announces the expansion of its Volta product line to incorporate Volta180 probe heads, to support the Wafer Level Packages and Known Good Dies test businesses. The recent acceleration of the digital age is creating a


huge demand for new consumer/commercial electronics to incorporate expanding functional needs into reduced space, in a cost-effective manner. This has resulted in a huge growth in Wafer Level Packages and Known Good Dies. “The technical challenges and increases in packaging costs


are fueling the growth of Wafer Level Packages and Known Good Dies,” said Bruce Valentine, Vice President Business Development at Smiths Interconnect. “Smiths Interconnect’s Volta 180 Series addresses the market’s needs for reduced test time and increased throughput with a cost-effective,


high-performance option, ideal to achieve high bandwidth, high reliability, low contact resistance and long life”. For more information visit our Volta Series Probe Head page.


Smiths Interconnect u +39 010 60361 u www.smithsinterconnect.com


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