MICR P


STICKING TOGETHER GAN-ON-SILICON MONOLITHIC MICROLED BONDED DISPLAYS augmented and mixed reality (AR/MR) display applications,


STIC GAN


CKING TOGETH -ON-SILICON MO ROLED BONDED D


y, an embedded technologies de mented and mixed reality (AR/MR


HER


ONOLITHIC DISPLAYS


lessey, an embedded technologies developer involved in augm


has announced a monolithic microLED bonded display, alongside its backplane partner, Jasper Display. Its defining feature? The wafer level bonding of GaN-on-silicon m microLED wafers, with the help of Jasper Display’s eSP70, silicon patented backplane technology. Featuri


D wafers, with the help of Jasper Display’s eSP70, patented backplane technology.


monochrome pixels on a pitch of eight m


Featuring an array of 192 onochrom


ing an array of 1920 x 1080 current-driv ent-driven microns, Plessey’s


microLED display can colour control each pixel, thanks to the JDC backplane: the CMOS backplane wafer, bonded to the GaN- on-silicon LED wafer, incorporates over 100 million micro lev 100 million micro level bonds between the wafers.


D display can colour control each pixel, thanks to the kplane: the CMOS backplane wafer, bonded to the GaN- on LED wafer, incorporates over 100 m etween the wafers.


h pixel, thanks to the er, bonded to the GaN-


T.I. Lin , vice president of marketing and product management at Jasper Display, says: y’s monolithic microLED array is a great or JDC’s high-density silicon backplane. 7


T.I. Lin, vice president of marketing and product management at Jasper Display, says: “Plessey’s monolithic m


d says:


The JD27E series demonstrates our ability to deliver w


microLED display requirem Plessey


icroLED display requirements in mind.”


deliver what our valuable partner Plessey and the wide


the wider industry has been waiting for: silicon backplanes that hav


match for JDC’s high-density silicon backplane. The JD27E series demonstrates our ability to what our valuable partner Plessey and er industry has been waiting for: silicon nes that have been designed with their D display requirements in mind.”


a great kplane. ty to


silicon h their ”


www.plesseysemiconductors.com tors.com www.plesseysemiconductors.com


ounced a monolithic microLED bonded display, de its backplane partner, Jasper Display. Its defining ? The wafer level bonding of GaN


veloper involved in R) display applications, onded display, Display. Its defining


-on-silicon monolithic r Display’s eSP70,


1 to 8 channels 8 product variations 16 bit resolution with 40 MS/s and 125 MS/s 700 MByte/s streaming over fast PCIe x4 interface Output ±6 V (1 MΩ) or ±3 V (50Ω)


SPECTRUM I NS T RUMENT A T I ON Perfect fit – modular designed solutions Europe / Asia: Phone +49 (4102) 695 60 | US: Phone (201) 562 1999 www.spectrum-instrumentation.com


For the


very latest news on the go


www.connectingindustry.com/electronics Also available now in the App Store or Google Play


M2p.65xx


New multi-channel AWG series


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