MANUFACTURING


The power of the plasma pen: Revolutionising adhesion in electronics manufacturing


In the electronics industry, plasma has already been adopted in electronics, PCB and semiconductor manufacturing to improve adhesion for Anisotropic Conductive Film assembly, manufacture silicon photovoltaic cells and bond polymers with adhesives.


A


dditional applications include enhancing the performance of inks, dyes, potting materials, over-molding and  used for surface cleaning of wire and die      the plasma state,” explains Ryan Blaik, sales  precise application and control, plasma can alter surface properties of printed circuit  without compromising the underlying 


  


 applying plasma to a product’s surface,    [atmospheric] pressure conditions using 


  or the entire part,” explains Blaik, adding that often plasma pens are incorporated into automated inline manufacturing processes 


Solving adhesion challenges For most electronics applications, plasma treatments are utilised to increase the   of all intermolecular forces that are on the surface of a material, the degree of attraction or repulsion force of a material


    are several mechanisms for increasing surface energy with plasma, including precision cleaning, chemically or physically modifying the surface, increasing surface  


        for preparing materials in overmolding processes, including polypropylene applications, dip coatings, or any method that involves encasing or encapsulating 


32 SEPTEMBER 2025 | ELECTRONICS FOR ENGINEERS


  overmold to spread more effectively across the surface and minimises the formation of   


 overmolding is to safeguard electronic     also in the form of small air pockets on,   


  many types of materials, including polymers,   


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