MEDICAL, MILITARY & INDUSTRIAL ELECTRONICS
This technique employs high-frequency sound waves to detect even the smallest defects in components or assemblies without sound waves into electronic materials and structures, ultrasonic inspection can expose Scanning Acoustic Microscopy (SAM) is a more specialized ultrasonic method that uses much higher frequencies, usually between 50 “SAM extends defect detection to an entirely new scale: scans that were once limited to 50 microns, exposing imperfections that previously went undetected,” says Hari Polu, President of PVA TePla OKOS, a Virginia-based manufacturer of SAM and industrial ultrasonic Unlike conventional ultrasonic NDT, which with complex shapes, SAM is designed to generate highly detailed acoustic images of “SAM’s high-frequency operation delivers exceptional resolution at the micron or sub-micron level, a precision best suited for analysing thin samples and layered
SAM applications in electronics and metals
In the semiconductor and electronics industries, the need for non-destructive failure analysis and reliability testing is evolved and is now being used to detect irregularities in these types of materials that constitute the “packaging” of semiconductor
themselves, today’s electronics products contain various specialty metals, alloys, semiconductor components need to be enclosed and packaged in consumer usable evolved and is now being used to detect irregularities in these types of materials that constitute the “packaging” of semiconductor
Today, the same rigor of quality testing and failure analysis is also being applied to validate the integrity of diffusion bonded bond strength can approach that of the bond performance depends on the type of intermetallic compounds that form, the thickness of the intermetallic layer and the
can be simple and user friendly, advanced for detailed analysis, or automated for “PVA TePla OKOS decided early on to deliver a software-driven, ecosystem-based Acoustic Microscopy software supports a wide range of transducer frequencies from
Testing is an essential element of high reliability lasting dependability prior to deployment.
presence of microscopic defects such as of the interface, materials engineers must analyse samples to validate the quality of the
SAM operates by directing a focused beam of ultra-high-frequency sound from a transducer onto a tiny point on the target direction of scattered pulses and measuring determines the presence of a boundary or Three-dimensional images are created by scanning point by point and line by line on and processed by special imaging software can analyse SAM images to detect and delamination, inclusions and voids in bonding interfaces as well as evaluate soldering and As important as the mechanical aspects are when conducting a scan, the software is critical to improving the resolution and
C-scans, contour following, off-line analysis and virtual rescanning for composites, metals and alloys, which result in highly accurate internal and external inspection for defects and thickness measurement via the
These software capabilities not only expand SAM’s functionality, but they also set the stage for tackling one of the industry’s toughest A common challenge with other inspection systems is performing scans quickly enough to remove defective materials without advancements in SAM technology have and defect detectability, while maintaining
take 45 minutes to inspect a 10-inch square alloy, an advanced phased array [SAM] with more granular detection of small “Every company will eventually move towards this level of failure analysis because of the level of detection and precision required for specialty metals and materials,” savings of Industrial SAM equipment make
purity metals, SAM extends inspection to the platforms continue to push the limits of performance, this level of testing is no longer optional, it is essential to ensuring reliability
Ultrasonic non-destructive testing (NDT) employs high-frequency sound waves to detect even the smallest defects in components or assemblies
NOVEMBER 2025 | ELECTRONICS FOR ENGINEERS 25
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46
