MEDICAL, MILITARY & INDUSTRIAL ELECTRONICS


Suppliers have already begun exiting parts of the heat shrink and tape sector. The search for viable alternatives is underway, but no replacement materials have yet  any new solution will require extensive validation, which can take several years. In the meantime, engineers must justify existing material use with greater rigour, even as uncertainty persists over what future replacements may look like. Staying ahead of these shifts requires close coordination with suppliers, awareness of regulatory timelines, and visibility into material availability. Engagement with standards bodies, such as the SAE or NEMA spec committees, has become increasingly valuable, not only for anticipating change, but for helping shape it.


Rising demands, narrowing margins


Thermal resilience is no longer just a checkbox. As systems become more compact and power-dense, and as more platforms operate in low Earth orbit or variable thermal environments, the expectations placed on wiring systems are expanding. Engineers must weigh factors like weight, cost, availability and temperature


rating, often within compressed demand cycles. Lead times for key materials can stretch into months, delaying harness  programme timelines.


 don’t provide the full picture. Design assurance comes from understanding how materials interact under pressure, and


how sourcing decisions affect long-term performance. From selection through to integration, reliability relies on consistent, informed decision-making at every stage of the process.


For more information on high-temperature wiring materials or to discuss harness system requirements, contact WireMasters at www.wiremasters.com/contact-us.


www.efemag.co.uk


ENGINEERS LECTRONICS FOR


November 2025


Tag-Connect solutions for all PCBs


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ENGINEERS LECTRONICS FOR


October 2025


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ENGINEERS LECTRONICS FOR


September 2025


www.efemag.co.uk


ENGINEERS LECTRONICS FOR


July/August 2025


Enclosure solutions for every application www.bopla.de/en


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Coming up in the December/January 2026 issue


• Southern Manufacturing and Electronics Show preview


• Power • Enclosures


• Artificial Intelligence • Smart Tech & IOT • Supply Chain • Manufacturing


If you are interested in being part of our next issue, please contact Samuel sjones@datateam.co.uk for editorial; or Jordan jtait@datateam.co.uk or 01622 699139 for advertising.


NOVEMBER 2025 | ELECTRONICS FOR ENGINEERS 23


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