MEDICAL, MILITARY & INDUSTRIAL ELECTRONICS


Ensuring high reliability in aerospace materials and electronics with SAM


Scanning Acoustic Microscopy (SAM) has become a critical   validating material integrity.


I


n aerospace and defence, the electronics and materials incorporated into satellites, aircraft and defence platforms are expected to function in conditions that push the limits of materials science and engineering design. Unlike consumer-grade devices, which may tolerate minor faults, aerospace devices cannot afford a single unexpected failure, since mission success and human safety depend on consistent performance. This principle forms the foundation of a high-reliability approach, an engineering philosophy focused on designing and manufacturing systems, components and processes that must perform dependably under mission-critical or extreme conditions. Such conditions may include  mechanical shock and vibration and corrosive environments.


Achieving high reliability in aerospace and


defence requires the deliberate selection of specialised materials coupled with durability- focused design practices to ensure structural and electrical integrity when subjected to extreme stress.


To counter continuous vibration and sudden mechanical shocks, components are often housed in metal enclosures, and their materials are selected for their proven resistance to fatigue and cracking under dynamic loads. High-reliability components may also incorporate specialised coatings and corrosion-resistant alloys that protect against moisture, salt and fuel vapors. To withstand prolonged mechanical and environmental stress, materials are layered and bonded in a way that helps prevent delamination and surface fractures. However, even with the most advanced designs and high-performance materials, 


structural components can trigger system- wide failure once in operation. Hidden defects such as microscopic voids in solder joints, delamination within composite structures, or cracks in semiconductor packages may remain undetected during fabrication. When subjected to the extremes of vibration,  compromise the entire system. Testing is therefore an essential element of high reliability to ensure potential   dependability prior to deployment. This is where nondestructive evaluation methods become indispensable.


Ultrasonic NDT


Ultrasonic non-destructive testing (NDT) has long served as a core inspection method within the aerospace and defense sectors.


Scanning Acoustic Microscopy (SAM) is a more specialized ultrasonic method that uses much higher frequencies, usually between 50 megahertz and several gigahertz.


24 NOVEMBER 2025 | ELECTRONICS FOR ENGINEERS


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