INTERCONNECTION
Advanced Interconnections launched new family of board-to-board connectors featured at electronica 2024
Advanced Interconnections, headquartered in West Warwick, Rhode Island and designer and manufacturer of customised interconnect solutions for the electronics industry, has launched a new family of board-to-board connectors, which will be featured at electronica 2024 Stand B2. 130.
T
hese new board-to-board connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available.
Many industrial, defense, aerospace and automotive board designers are faced with the challenge of accounting for board-to-board interconnects that are ever denser and requiring higher speeds than legacy solutions. Moreover, there is a demand for these highly dense connectors to also be pick-and-place accessible for ease of mass manufacturing. Developing can withstand harsh environmental conditions is an extreme challenge, especially considering how small and fragile such compact contacts are intrinsically. Fortunately, AIC is up for such a challenge and has designed a new series of board-to-board connectors that are uniquely suited to modern PCB interconnect challenges.
Designed for long-life applications and robust handling, these new connectors are manufactured with screw-machined include a wealth of value-added features and come with either protective pick-and-place covers or heavy duty, shrouded insulators. The options of covers or insulators help to provide positive polarisation and offer superior durability for the connectors. Available in standard pitch sizes including 0.50 mm, 0.65 mm, 0.75, 0.80 mm and 1.00 mm, these connectors deliver low signal attenuation, insertion loss and return loss. Even with adjacent aggressor
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Unlike many other board-to-board connectors on the market, AIC’s new connectors do not require external
hold-downs and include a shrouding feature that protects the pin
placement.
excitation, the socket systems provide a differential path of +/- 175mV @ 100 psec and a single-ended data path of +/- 125 mV @ 140 psec. Using innovative, hybrid design features, this socket technology is able to minimise adjacent terminal electromagnetic NeXT/FeXT. Additionally, this hybrid design creates a pseudo-matched impedance environment that stabilises the insertion loss
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and return loss when differentially driven. These board-to-board connectors with
arranged in an interstitial male/female pin pattern that sport gold-plated contacts for high-quality gold/gold interconnect. This added gold plating on the connector contacts minimises corrosion in most environments and provides extremely long-life contacts capable of repeated matching cycles.
Unlike many other board-to-board connectors on the market, AIC’s new connectors do not require external hold-downs and include a shrouding feature placement. These new connectors can be selected with either eutectic Tin/Lead or lead-free Tin/Silver/Copper solder ball terminals for RoHS compliant applications. Optional stand-offs are also available with these connectors.
AIC’s new Board to Board Connections are now available in a variety of standard options with the ability to readily customise requirements, please call +1 401.823.5200.
DECEMBER/JANUARY 2025 | ELECTRONICS FOR ENGINEERS 25
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