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ENGINEERS LECTRONICS FOR


April 2026


ENGINEERS LECTRONICS FOR


April 2026 In this issue


 power solutions is driving demand for power management devices that provide higher power density and simplify system design.


IN THIS ISSUE • Power


• Enclosures • Aerospace, Military & Defence • Embedded Technology • Distribution • Medical Electronics


1 E4E Cover.indd 1 27/04/2026 14:09


Microchip Technology has announced a new family of DualPack 3 (DP3) power modules featuring advanced IGBT7 technology available in six variants at 1200V and 1700V with high-current ranging from 300–900A.


The new DP3 power modules are designed to address the  power converter solutions.


Contents


Editor’s Comment & News Features


6 Fuelling the Defence Industrial Strategy innovation goals from South Wales


Power 8 More power, less compromise: Active load bearing for DIN rail systems


10 Advancing Uninterruptible Power Supply technology for AI-driven demands


12 Powering Germany’s next-generation grid 14 Use scalable, compact and intelligent DIN rail DC power supplies for industrial power


Enclosures 16 How to manage heat in modular, COTS enclosures


18 Where are spring hinges the preferred option 


Aerospace, Military and Defence 19 Standardising the edge 20  manufacturing


22 Building PNT resilience with Silicon Timing 24 Why winning a MOSA advantage starts with cultural change


25 Managing lifecycle risk in electronic design- The role of ASICs in overcoming IC obsolescence


Embedded Technology 26 Designing with embedded modules 28 Smart Manufacturing: Five ways to properly digitise your business


30 Transmission tradeoffs in robot control


Distribution 32 Worldwide sourcing solutions for obsolete and 


34 The key to connector reliability


Medical Electronics 36 Breaking the bottleneck: Flash storage considerations for high-throughput medical imaging systems


40 Why cleaning medical PCBAs is getting harder


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APRIL 2026 | ELECTRONICS FOR ENGINEERS


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