AEROSPACE, MILITARY & DEFENCE Managing lifecycle risk in electronic design –
The role of ASICs in overcoming IC obsolescence
By Ross Turnbull, director, business development, Swindon Silicon Systems
I
n 2023, manufacturers declared nearly 474,000 electronic components obsolete, a shapes long-term risk across industrial, aerospace and automotive programmes. The scale of the issue highlights the need for more resilient design strategies. Recent data from Z2Data underscores the unpredictability of the situation. In 2023, more than 328,100 end of life notices were recorded, with around 82,200 lifecycle changes occurring without any product per cent of all lifecycle events. The absence of advance notice leaves manufacturers exposed, often forcing urgent redesigns, last minute sourcing decisions or production delays. These disruptions place pressure on delivery commitments and can compromise product reliability.
Understanding the obsolescence crisis
The core issue is a structural mismatch between the lifespan of integrated circuits and the systems they support. Many ICs are designed to last for ten to 15 years, yet the equipment they power often remains in service for 20 to 30 years. Even well- planned designs can lose access to critical components without warning, forcing costly redesigns or programme delays. The high volume of obsolescence events and limited warning means reactive approaches are no longer enough. Obsolescence must be treated as a
continuous, strategic concern, supported by technically robust solutions.
The limitations of standard ICs Standard off the shelf ICs have clear limitations. Manufacturers may offer a last time buy (LTB) when a component reaches the end of its production life. While this provides a temporary buffer, it requires forecasting. Miscalculations can result in excess inventory or shortages. Storage over long periods adds cost and risk. Sourcing alternative components is rarely simple. Even similar parts may differ in performance, triggering redesign and applications, minor deviations can have major consequences. These challenges highlight the growing inadequacy of standard ICs for products expected to operate over decades.
A strategic solution
(ASICs) offer a more robust solution. ASICs allow manufacturers to control component availability and reduce dependence on application, an ASIC can replicate or improve upon an obsolete component while ensuring continuity of supply.
lines, as a single design can support multiple applications. By integrating functions into one device, manufacturers can reduce
power consumption, shrink physical footprint and simplify the bill of materials. Reliability is enhanced through design control and reduced component count. They also strengthen intellectual property protection, as designs are harder to reverse engineer, making them valuable in sectors where security, compliance and functional safety are critical.
Swindon Silicon brings over 50 years of experience designing and supplying ASICs for industrial, aerospace and automotive markets. This expertise allows manufacturers to replace obsolete components with functionally equivalent solutions optimised for modern performance and long-term availability.
Planning for long term resilience Obsolescence requires an ongoing, proactive strategy. While long-term planning is essential, manufacturers also need solutions that protect production and service commitments now. Implementing an ASIC provides a stable foundation for broader obsolescence management. With the right support, component availability can be actively managed. Swindon Silicon works with customers to maintain supply through methods such as long-term wafer storage in controlled environments and porting designs to updated manufacturing processes. This ensures products remain viable as underlying technologies evolve.
shows no sign of slowing. With hundreds of thousands of components reaching end of life each year and many changes occurring without warning, manufacturers face growing exposure to disruption. ASICs offer a practical route to reducing that risk, For manufacturers confronting obsolescence today, the need for action is immediate. With the right approach and partner, it is possible to move beyond reactive measures and build resilience into the foundation of product design.
APRIL 2026 | ELECTRONICS FOR ENGINEERS
25
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50
