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cutout on a fan mounting plate should be larger than the inlet diameter of the fan, and objects in the air inlet area should be located more than 1/2” from the fan diameter.


Since fans and blowers are measured in static pressure, a good rule of thumb is to select a model that will perform at greater than 60 per cent of its “free air” maximum, based on estimated static pressure. As in any system design, certain tradeoffs need to be made when considering cooling   needed to protect certain electronics and     the opening, but is far more expensive than simple perforations.


But options exist and can easily be integrated into a modular design. For example, variable speed temperature regulated fans can be employed to reduce noise and tachometer output fans can monitor fan fail conditions and increase system operation.


The answers are found not only in


ENCLOSURES


Figure 3: A right-sized enclosure design example (Stylebox-15)


hardware options, but in software, too, through thermal simulation, which enables the designer to input all of the variables into a program and verify that the cooling is adequate prior to system fabrication. Better yet, if time and budget allow, building and testing a thermal “mock up” will provide even deeper insights into how well the cooling structure performs.


Smart design for optimum operation


To satisfy the demands of any given environment and especially as electronics get increasingly smaller, engineers must consider a myriad of design elements from mechanical constraints, cooling requirements and power distribution, to 





Addressing any one of these issues can be   target and under time-to-market pressures, illustrates the importance of experienced packaging design.


Properly designing an enclosure requires smart thinking at many levels, and heat dissipation is merely one aspect, albeit an   electronics put more pressure on cooling techniques. But by relying on proven design principles that incorporate a whole system view, designers can produce custom- tailored enclosures for modern electronics applications, while keeping design costs to a minimum.


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