Test & measurement
Figure 2. Configurability allows the most efficient use of the tester’s RF ports.
for production use is the ability to accelerate the test cycle time. In addition to rapid signal generation, acquisition, and analysis, the ability to perform multiplexing and parallel testing to handle several units concurrently, including providing multiple measurement channels, significantly increases throughput. The flexible buffer in between data capture and evaluation allows the R&S PVT360A to process the data from one RF measurement while at the same time capturing the next. This enables parallelisation, to reduce test cycle time. In addition, with two internal transceivers thereby creating two independent pairs of
signal generator and analyser, it can test two devices simultaneously doubling the throughput.
In addition, internal hardware-accelerated sequencing that controls the signal generation and analysis enables test results from the measurements to be output, once a test sequence has been loaded and started, without any external interactions slowing down the process. The generation and analysis functions have separate command lists to ensure maximum flexibility. An internally aligned process flow between both sides performs measurements across level, frequency, and
NI ANNOUNCES REAL-TIME ANALYTICS ENABLEMENT BY COLLABORATING WITH LEADING ATE VENDOR
N
I has announced a new initiative to deliver real-time semiconductor analytics solutions at the edge using
their NI Global Operations (GO, formerly Optimal+) platform. This new level of infrastructure and control opens the door for more advanced and customised applications developed by platform users, NI, and even third parties. The announcement is highlighted by a new enablement layer within the NI GO ecosystem and initial integration with leading ATE vendor, Teradyne. Increasing quality, yield, throughput, and functionality demands on semiconductor test operations have spurred interest in developing better, more responsive test controls. To address this, the new NI Global Operations Real- time Application Enablement Layer extends existing GO platform capabilities to secure, low latency tester servers so analytics models can run in-line with test execution. Rudy Sengupta, NI VP & GM of Test and Analytics Software, adds, “All trends in the semiconductor industry point
to a greater emphasis on test. To keep up, our customers need to make test decisions faster, which now means in-line with the test itself. To make this viable, we understand the value of ecosystem collaboration, and see our new Real-time Enablement Layer and ATE partnerships as a critical inflection point in the value, we can derive from test analytics.” The new enablement layer enhances the open architecture and robust analytics capabilities of NI Global Operations by adding integrated support for ATE test floor platforms. Their local data, security, and communication protocols combined with NI GO backend analytics creates a complete and trusted solution for real-time control in semiconductor test. Starting with Teradyne means their tester footprints will have access to these new capabilities. In addition, the open architecture will allow any and all ATE vendors and platforms to be supported in the future, with more planned announcements to come.
NI
www.ni.com
other parameters in minimal time creating a continuous flow of test results.
The internal design also contains a switch matrix that maps the fixture ports to the test ports to facilitate quickly loading multiple devices into the text fixture. In total, there are 16 RF ports with a fully integrated switch matrix that enables fast and easy switching between the different ports and hence the different DUTs. On the other hand, taking the data for one port at a time allows running two analysers of the two transceivers in parallel and recording data from two different devices simultaneously.
A smart channel option provides up to eight virtual instruments for easier production planning and instrument programming (Figure 2). All handling, scheduling, and switching between the ports is done automatically with the smart channel option to maximise resource utilisation and speed.
In addition, support for test automation allows users to create test sequences that can be executed without manual intervention. This can include multiple instruments and control of the test device.
Bringing all the elements of the reference test environment into a single, optimised and production-ready, yet flexible, test instrument also simplifies the scaling of test activities if the production volume increases. It is easier to add more measurement channels, expand the test system, or integrate with other equipment to meet increasing production demand.
CONCLUSION Testing RF components such as front-ends and power amplifiers challenges product developers to create a reference test station with cutting- edge performance over a wide range. For volume manufacturing, a flexible instrument that enables the key attributes of the reference setup to be replicated in a compact form factor can simplify characterisation and testing, enhancing the speed, efficiency, and scalability of production. This approach improves throughput in production and characterisation and helps reduce the cost per device.
Rohde & Schwarz
www.rohde-schwarz.com 58 October 2023 Instrumentation Monthly
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