Cases & enclosures
B
OPLA , a leading specialist in electronic enclosures, has introduced BoVersa, an innovative new enclosure concept designed for next-generation wireless, embedded, and instrumentation systems. Combining modern design with robust engineering, BoVersa delivers maximum flexibility for equipment designers while ensuring long-term reliability, even in challenging outdoor environments.
ADVANCED DESIGN FOR MODERN APPLICATIONS
BoVersa has been developed to meet the increasing demands of IoT, wireless, embedded, and instrumentation markets. The enclosure can be configured for hand-held, tabletop, wall, or pole-mounted applications, making it suitable for diverse fields such as security, measurement, and communication technology.
A unique three-part enclosure structure—comprising a lower part, functional lid, and design cover—offers designers unprecedented flexibility. These components can be combined in various colours, with options for transparent or translucent lids, enabling lighting effects, visibility of displays, or a clean, closed design.
A NEW ENCLOSURE CONCEPT
OPTIMISED FOR WIRELESS AND COOLING
For wireless systems, BoVersa integrates a die-cast aluminium body with cooling fins combined with a plastic cover. This ensures both unhindered radio transmission and efficient thermal management, essential for electronics with high power density. The point-symmetrical fin design guarantees uniform airflow in both vertical and horizontal mounting positions. This maximises cooling efficiency, stabilises internal temperature distribution, and extends the service life of sensitive electronics.
BUILT FOR HARSH ENVIRONMENTS BoVersa’s robust construction makes it suitable for outdoor deployment. With protection class up to IP66 / IP68 (1.2m for 2h, DIN EN 60529) and use of PC UL 94 V0 material, the enclosure withstands environmental stresses while ensuring safety and durability. Integrated options include a pressure equalisation diaphragm and direct mounting tabs.
Key Features of BoVersa:
Transparent or translucent functional lids for displays and lighting effects
Wide range of colour combinations for custom branding
Open or closed versions for keyboards, displays, or seamless designs
Hidden screws and optional die-cast aluminium covers for added stability
Optional pole attachment accessory
Integrated receptacle for pressure equalisation diaphragm
Enhanced cooling fins with symmetrical airflow design
COMPLETE CUSTOMISATION & SERVICES BOPLA supports customers with a full box-build service, including mechanical processing, printing, engraving, lacquer finishing, PCB assembly, and custom colour schemes. A custom design sample service is also available to accelerate product development. “With BoVersa, we are taking into account the growing requirements of users and expanding our portfolio in a targeted manner. We offer a holistic solution for numerous applications, developed on the basis of current market needs,” says Andreas Krömer, head of development at BOPLA.
BOPLA 42
www.bopla.co.uk November 2025 Instrumentation Monthly
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