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Compatible: C-flat™


provides a regular


array of analysis sites compatible with automated data collection software such as Leginon. This compatibility, in combination with the more uniform ice thickness and particle distribution reported by numerous researchers, results in more high-quality target sites per grid.


C-flat™ Holey Carbon Grids for TEM Thick, Copper Only


Product Code Cat. #


CF-1.2/1.3-2C-T CFT213-50 CFT213-100


CF-1.2/1.3-3C-T CFT313-50 CFT313-100


CF-1.2/1.3-4C-T CFT413-50 CFT413-100


CF-2/1-2C-T CF-2/1-3C-T CF-2/1-4C-T


CF-2/2-2C-T CF-2/2-3C-T CF-2/2-4C-T


CF-2/4-2C-T CF-2/4-3C-T CF-2/4-4C-T


CF-4/1-2C-T CF-4/2-2C-T


CF-4/2-3C-T CF-4/2-4C-T


CF-MH-2C-T CF-MH-3C-T CF-MH-4C-T


CF-1/1-3C-T CF-1/1-4C-T


CFT212-50 CFT212-100 CFT312-50 CFT312-100 CFT412-50 CFT412-100


Hole Size


1.2 µm 1.2 µm 1.2 µm 1.2 µm 1.2 µm 1.2 µm


2.0 µm 2.0 µm 2.0 µm 2.0 µm 2.0 µm 2.0 µm


CFT-222C-50 2.0 µm CFT-222C-100 2.0 µm CFT-223C-50 2.0 µm CFT-223C-100 2.0 µm CFT-224C-50 2.0 µm CFT-224C-100 2.0 µm


CFT242-50 CFT242-100 CFT342-50 CFT342-100 CFT442-50 CFT442-100


CFT241-100 CFT422-50


CFT422-100 CFT423-50 CFT423-100 CFT424-50 CFT424-100


CFT2MH-50 CFT2MH-100 CFT3MH-50 CFT3MH-100 CFT4MH-50 CFT4MH-100


CFT31-100 CFT41-100


2.0 µm 2.0 µm 2.0 µm 2.0 µm 2.0 µm 2.0 µm


4.0 µm 4.0 µm


4.0 µm 4.0 µm 4.0 µm 4.0 µm 4.0 µm


Hole TEM TEM Spacing Mesh Grid


1.3 µm 200 Cu 1.3 µm 200 Cu 1.3 µm 300 Cu 1.3 µm 300 Cu 1.3 µm 400 Cu 1.3 µm 400 Cu


1.0 µm 200 Cu 1.0 µm 200 Cu 1.0 µm 300 Cu 1.0 µm 300 Cu 1.0 µm 400 Cu 1.0 µm 400 Cu


2.0 µm 200 Cu 2.0 µm 200 Cu 2.0 µm 300 Cu 2.0 µm 300 Cu 2.0 µm 400 Cu 2.0 µm 400 Cu


4.0 µm 200 Cu 4.0 µm 200 Cu 4.0 µm 300 Cu 4.0 µm 300 Cu 4.0 µm 400 Cu 4.0 µm 400 Cu


1.0 µm 200 Cu 2.0 µm 200 Cu


2.0 µm 200 Cu 2.0 µm 300 Cu 2.0 µm 300 Cu 2.0 µm 400 Cu 2.0 µm 400 Cu


Multihole* Multihole* Multihole* Multihole* Multihole* Multihole*


1.0 µm 1.0 µm


200 Cu 200 Cu 300 Cu 300 Cu 400 Cu 400 Cu


1.0 µm 300 Cu 1.0 µm 400 Cu


Qty. 50/pk.


100/pk. 50/pk.


100/pk. 50/pk.


100/pk. 50/pk.


100/pk. 50/pk.


100/pk. 50/pk.


100/pk. 50/pk.


100/pk. 50/pk.


100/pk. 50/pk.


100/pk. 50/pk.


100/pk. 50/pk.


100/pk. 50/pk.


100/pk. 100/pk 50/pk.


100/pk. 50/pk.


100/pk. 50/pk.


100/pk. 50/pk.


100/pk. 50/pk.


100/pk. 50/pk. 100/pk


100/pk. 100/pk.


The Multihole device has a staggered pattern of six features consisting of three circle patterns of 1 micron, 1.4 micron and 2 micron diameter and three ellipse patterns of 1 x 4 microns, 1.4 x 5.6 microns and 2 x 8 microns.


Clean: C-Flat™


in its production. This means C-Flat™


uses no plastics or polymers is


shipped clean, so it’s ready to use out of the box and requires no solvent washing steps prior to use, leading to less breakage of the holey carbon film.


C-flat™ Holey Carbon Grids for TEM Gold Only


Product Code Cat. #


Hole Size


CF-1.2/1.3-2Au CF213-50-Au 1.2 µm CF213-100-Au 1.2 µm


CF-1.2/1.3-3Au CF313-50-Au 1.2 µm CF313-100-Au 1.2 µm


CF-1.2/1.3-4Au CF413-50-Au 1.2 µm CF413-100-Au 1.2 µm


CF-2/1-2Au CF-2/1-3Au CF-2/1-4Au


CF-2/2-2Au CF-2/2-3Au CF-2/2-4Au


CF-2/4-2Au CF-2/4-3Au CF-2/4-4Au


CF-4/1-4Au CF-4/2-2Au


CF-4/2-3Au CF-4/2-4Au


CF-MH-2Au CF-MH-3Au CF-MH-4Au


CF212-50-Au 2 µm CF212-100-Au 2 µm CF312-50-Au 2 µm CF312-100-Au 2 µm CF412-50-Au 2 µm CF412-100-Au 2 µm


CF222C-50-Au 2 µm CF222C-100-Au 2 µm CF223C-50-Au 2 µm CF223C-100-Au 2 µm CF224C-50-Au 2 µm CF224C-100-Au 2 µm


CF242-50-Au 2 µm CF242-100-Au 2 µm CF342-50-Au 2 µm CF342-100-Au 2 µm CF442-50-Au 2 µm CF442-100-Au 2 µm


CF441-100-Au 4 µm CF422-50-Au 4 µm


CF422-100-Au 4 µm CF423-50-Au 4 µm CF423-100-Au 4 µm CF424-50-Au 4 µm CF424-100-Au 4 µm


CF2MH-50-Au CF2MH-100-Au CF3MH-50-Au CF3MH-100-Au CF4MH-50-Au CF4MH-100-Au


Hole TEM TEM Spacing Mesh Grid


1.3 µm 200 Au 1.3 µm 200 Au 1.3 µm 300 Au 1.3 µm 300 Au 1.3 µm 400 Au 1.3 µm 400 Au


1 µm 200 Au 1 µm 200 Au 1 µm 300 Au 1 µm 300 Au 1 µm 400 Au 1 µm 400 Au


2 µm 200 Au 2 µm 200 Au 2 µm 300 Au 2 µm 300 Au 2 µm 400 Au 2 µm 400 Au


4 µm 200 Au 4 µm 200 Au 4 µm 300 Au 4 µm 300 Au 4 µm 400 Au 4 µm 400 Au


1 µm 400 Au 2 µm 200 Au


2 µm 200 Au 2 µm 300 Au 2 µm 300 Au 2 µm 400 Au 2 µm 400 Au


Multihole* Multihole* Multihole* Multihole* Multihole* Multihole*


200 Au 200 Au 300 Au 300 Au 400 Au 400 Au


Qty. 50/pk


100/pk 50/pk


100/pk 50/pk


100/pk 50/pk


100/pk 50/pk


100/pk 50/pk


100/pk 50/pk


100/pk 50/pk


100/pk 50/pk


100/pk 50/pk


100/pk 50/pk


100/pk 50/pk


100/pk 100/pk 50/pk


100/pk 50/pk


100/pk 50/pk


100/pk 50/pk


100/pk 50/pk


100/pk 50/pk


100/pk


C-flat™ Holey Carbon Grids for TEM Thick Gold Only


Product Code Cat. # CF-2/4-3Au-T


CF-4/2-3Au-T CF-MH-3Au-T


Hole Size


CFT342-50-Au 2.0 µm CFT342-100-Au 2.0 µm CFT423-50-Au 4.0 µm CFT423-100-Au 4.0 µm CFT3MH-50-Au CFT3MH-100-Au


Hole TEM TEM Spacing Mesh Grid


Multihole* Multihole*


4.0 µm 300 Au 4.0 µm 300 Au 2.0 µm 300 Au 2.0 µm 300 Au 300 Au 300 Au


Qty. 50/pk


100/pk 50/pk


100/pk 50/pk


100/pk


The Multihole device has a staggered pattern of six features consisting of three circle patterns of 1 micron, 1.4 micron and 2 micron diameter and three ellipse patterns of 1 x 4 microns, 1.4 x 5.6 microns and 2 x 8 microns.


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