Compatible: C-flat™
provides a regular
array of analysis sites compatible with automated data collection software such as Leginon. This compatibility, in combination with the more uniform ice thickness and particle distribution reported by numerous researchers, results in more high-quality target sites per grid.
C-flat™ Holey Carbon Grids for TEM Thick, Copper Only
Product Code Cat. #
CF-1.2/1.3-2C-T CFT213-50 CFT213-100
CF-1.2/1.3-3C-T CFT313-50 CFT313-100
CF-1.2/1.3-4C-T CFT413-50 CFT413-100
CF-2/1-2C-T CF-2/1-3C-T CF-2/1-4C-T
CF-2/2-2C-T CF-2/2-3C-T CF-2/2-4C-T
CF-2/4-2C-T CF-2/4-3C-T CF-2/4-4C-T
CF-4/1-2C-T CF-4/2-2C-T
CF-4/2-3C-T CF-4/2-4C-T
CF-MH-2C-T CF-MH-3C-T CF-MH-4C-T
CF-1/1-3C-T CF-1/1-4C-T
CFT212-50 CFT212-100 CFT312-50 CFT312-100 CFT412-50 CFT412-100
Hole Size
1.2 µm 1.2 µm 1.2 µm 1.2 µm 1.2 µm 1.2 µm
2.0 µm 2.0 µm 2.0 µm 2.0 µm 2.0 µm 2.0 µm
CFT-222C-50 2.0 µm CFT-222C-100 2.0 µm CFT-223C-50 2.0 µm CFT-223C-100 2.0 µm CFT-224C-50 2.0 µm CFT-224C-100 2.0 µm
CFT242-50 CFT242-100 CFT342-50 CFT342-100 CFT442-50 CFT442-100
CFT241-100 CFT422-50
CFT422-100 CFT423-50 CFT423-100 CFT424-50 CFT424-100
CFT2MH-50 CFT2MH-100 CFT3MH-50 CFT3MH-100 CFT4MH-50 CFT4MH-100
CFT31-100 CFT41-100
2.0 µm 2.0 µm 2.0 µm 2.0 µm 2.0 µm 2.0 µm
4.0 µm 4.0 µm
4.0 µm 4.0 µm 4.0 µm 4.0 µm 4.0 µm
Hole TEM TEM Spacing Mesh Grid
1.3 µm 200 Cu 1.3 µm 200 Cu 1.3 µm 300 Cu 1.3 µm 300 Cu 1.3 µm 400 Cu 1.3 µm 400 Cu
1.0 µm 200 Cu 1.0 µm 200 Cu 1.0 µm 300 Cu 1.0 µm 300 Cu 1.0 µm 400 Cu 1.0 µm 400 Cu
2.0 µm 200 Cu 2.0 µm 200 Cu 2.0 µm 300 Cu 2.0 µm 300 Cu 2.0 µm 400 Cu 2.0 µm 400 Cu
4.0 µm 200 Cu 4.0 µm 200 Cu 4.0 µm 300 Cu 4.0 µm 300 Cu 4.0 µm 400 Cu 4.0 µm 400 Cu
1.0 µm 200 Cu 2.0 µm 200 Cu
2.0 µm 200 Cu 2.0 µm 300 Cu 2.0 µm 300 Cu 2.0 µm 400 Cu 2.0 µm 400 Cu
Multihole* Multihole* Multihole* Multihole* Multihole* Multihole*
1.0 µm 1.0 µm
200 Cu 200 Cu 300 Cu 300 Cu 400 Cu 400 Cu
1.0 µm 300 Cu 1.0 µm 400 Cu
Qty. 50/pk.
100/pk. 50/pk.
100/pk. 50/pk.
100/pk. 50/pk.
100/pk. 50/pk.
100/pk. 50/pk.
100/pk. 50/pk.
100/pk. 50/pk.
100/pk. 50/pk.
100/pk. 50/pk.
100/pk. 50/pk.
100/pk. 50/pk.
100/pk. 100/pk 50/pk.
100/pk. 50/pk.
100/pk. 50/pk.
100/pk. 50/pk.
100/pk. 50/pk.
100/pk. 50/pk. 100/pk
100/pk. 100/pk.
The Multihole device has a staggered pattern of six features consisting of three circle patterns of 1 micron, 1.4 micron and 2 micron diameter and three ellipse patterns of 1 x 4 microns, 1.4 x 5.6 microns and 2 x 8 microns.
Clean: C-Flat™
in its production. This means C-Flat™
uses no plastics or polymers is
shipped clean, so it’s ready to use out of the box and requires no solvent washing steps prior to use, leading to less breakage of the holey carbon film.
C-flat™ Holey Carbon Grids for TEM Gold Only
Product Code Cat. #
Hole Size
CF-1.2/1.3-2Au CF213-50-Au 1.2 µm CF213-100-Au 1.2 µm
CF-1.2/1.3-3Au CF313-50-Au 1.2 µm CF313-100-Au 1.2 µm
CF-1.2/1.3-4Au CF413-50-Au 1.2 µm CF413-100-Au 1.2 µm
CF-2/1-2Au CF-2/1-3Au CF-2/1-4Au
CF-2/2-2Au CF-2/2-3Au CF-2/2-4Au
CF-2/4-2Au CF-2/4-3Au CF-2/4-4Au
CF-4/1-4Au CF-4/2-2Au
CF-4/2-3Au CF-4/2-4Au
CF-MH-2Au CF-MH-3Au CF-MH-4Au
CF212-50-Au 2 µm CF212-100-Au 2 µm CF312-50-Au 2 µm CF312-100-Au 2 µm CF412-50-Au 2 µm CF412-100-Au 2 µm
CF222C-50-Au 2 µm CF222C-100-Au 2 µm CF223C-50-Au 2 µm CF223C-100-Au 2 µm CF224C-50-Au 2 µm CF224C-100-Au 2 µm
CF242-50-Au 2 µm CF242-100-Au 2 µm CF342-50-Au 2 µm CF342-100-Au 2 µm CF442-50-Au 2 µm CF442-100-Au 2 µm
CF441-100-Au 4 µm CF422-50-Au 4 µm
CF422-100-Au 4 µm CF423-50-Au 4 µm CF423-100-Au 4 µm CF424-50-Au 4 µm CF424-100-Au 4 µm
CF2MH-50-Au CF2MH-100-Au CF3MH-50-Au CF3MH-100-Au CF4MH-50-Au CF4MH-100-Au
Hole TEM TEM Spacing Mesh Grid
1.3 µm 200 Au 1.3 µm 200 Au 1.3 µm 300 Au 1.3 µm 300 Au 1.3 µm 400 Au 1.3 µm 400 Au
1 µm 200 Au 1 µm 200 Au 1 µm 300 Au 1 µm 300 Au 1 µm 400 Au 1 µm 400 Au
2 µm 200 Au 2 µm 200 Au 2 µm 300 Au 2 µm 300 Au 2 µm 400 Au 2 µm 400 Au
4 µm 200 Au 4 µm 200 Au 4 µm 300 Au 4 µm 300 Au 4 µm 400 Au 4 µm 400 Au
1 µm 400 Au 2 µm 200 Au
2 µm 200 Au 2 µm 300 Au 2 µm 300 Au 2 µm 400 Au 2 µm 400 Au
Multihole* Multihole* Multihole* Multihole* Multihole* Multihole*
200 Au 200 Au 300 Au 300 Au 400 Au 400 Au
Qty. 50/pk
100/pk 50/pk
100/pk 50/pk
100/pk 50/pk
100/pk 50/pk
100/pk 50/pk
100/pk 50/pk
100/pk 50/pk
100/pk 50/pk
100/pk 50/pk
100/pk 50/pk
100/pk 50/pk
100/pk 100/pk 50/pk
100/pk 50/pk
100/pk 50/pk
100/pk 50/pk
100/pk 50/pk
100/pk 50/pk
100/pk
C-flat™ Holey Carbon Grids for TEM Thick Gold Only
Product Code Cat. # CF-2/4-3Au-T
CF-4/2-3Au-T CF-MH-3Au-T
Hole Size
CFT342-50-Au 2.0 µm CFT342-100-Au 2.0 µm CFT423-50-Au 4.0 µm CFT423-100-Au 4.0 µm CFT3MH-50-Au CFT3MH-100-Au
Hole TEM TEM Spacing Mesh Grid
Multihole* Multihole*
4.0 µm 300 Au 4.0 µm 300 Au 2.0 µm 300 Au 2.0 µm 300 Au 300 Au 300 Au
Qty. 50/pk
100/pk 50/pk
100/pk 50/pk
100/pk
The Multihole device has a staggered pattern of six features consisting of three circle patterns of 1 micron, 1.4 micron and 2 micron diameter and three ellipse patterns of 1 x 4 microns, 1.4 x 5.6 microns and 2 x 8 microns.
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