NEW Au-flat™ Holey Carbon Grids for High Resolution Imaging
Improve your image quality and resolution with the gold alloy film that reduces particle movement during imaging
What is Au-Flat?
Au-Flat is an ultrastable Cryo-EM sample support with a 45nm holey Gold alloy film on 3 mm gold mesh grids. Au-Flat is a derivative of our patented C-Flat product.
What varieties of Au-Flat are available?
Au-Flat is offered in two configurations:
1.2 μm/1.3 μm hole pattern on 300 mesh Gold grids 2μm/2μm Hole Pattern on 200 mesh Gold grids
What are the benefits of Au-Flat over Holey Carbon Supports like C-Flat?
Better reconstructions with less data Au-Flat significantly reduces beam-induced motion during imaging compared to carbon films, improving image quality and resolution.
Biocompatible
Au-Flat features a holey Au/Pd film on a gold mesh grid, so it’s chemically inert and biologically compatible.
Durable
Au-Flat’s film is significantly stronger than carbon films and is more capable of surviving the Cryo-EM workflow including tweezer handling, glow discharge, blotting, auto-grid loading and plunge freezing.
What are the benefits of Au-Flat over other Gold Foil TEM Grids?
Fewer Mistakes
The lighter color of the Au/Pd alloy film compared to the underlying gold mesh grid makes it easy to identify the “holey” side of the grid during sample prep. This ensures the sample is deposited on the correct side and that the grid is loaded and imaged in the correct orientation.
Stronger
Au-Flat is produced with gold mesh grids that are about 6 microns thicker than typical Cryo-EM grids. This makes the grids stiffer and less likely to bend or deform. The increased thickness is fully compatible with side-entry holders as well as auto-loaders.
NEW CD-flat™ Ordering Information
Product Code
GF-1.2/1.3-3Au-45nm-50 GF-1.2/1.3-3Au-45nm-5
GF-2/2-2Au-45nm-50 Cat. #
AUFT313-50 AUFT313-05
AUFT222-50
Hole Size
1.2 µm 1.2 µm
2 µm
The C-flat™ advantage in a new pattern CD-flat™ — the premier ultra-flat holey carbon grid is ready to use with no additional cleaning or handling steps, and is now available, featuring a NEW 8/2 hole pattern. CD-flat is designed for CD-TEM metrology of large specimens, like 3D NAND FIB lamella.
Spacing 1.3 µm 1.3 µm
2 µm
Hole
TEM TEM Mesh Grid
300 300
200
Au Au
Au
Qty.
50/pk 5/pk
50/pk
Holey Carbon Grids for Automated S/TEM Imaging and Metrology
Specifications Grid Material
Mesh Size O.D.
Film Material Film Thickness Hole Pattern
Copper
300 Mesh 3.05mm
Holey Carbon 40nm
8/2 (8 um diameter, 2 µ spacing between holes)
Ordering Information Product Code
CDF-8/2-3Cu-T-50
Cat. # CDFT823-50
Hole Size
8.0 µm
Hole
Spacing 2.0 µm
TEM TEM Mesh Grid
300 Cu
Qty. 50/pk
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