SECTION TITLE
INSTRUMENTATION • ELECTRONICS
DIAMONDS EV’S BEST FRIEND
ARE AN
A new technique for slicing diamonds into thin wafers is paving the way for their adoption as a next-generation semiconductor material
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www.engineerlive.com
hile silicon-based materials are currently the undisputed leaders in the fi eld of semiconductors, scientists
across the globe are continually seeking superior alternatives for next-generation electronics and high-power systems. Interestingly, diamonds are among the
most promising materials for applications such as fast telecommunications and power conversion in electric vehicles (EVs) and power plants, due to their exceptional properties. A diamond’s dielectric breakdown strength is three times higher than in silicon carbide (SiC) and more than 30 times higher than in silicon (Si). In addition, unlike most other wide band gap (WBG) semiconductors, the carrier mobility is very high for both
carrier types, and the thermal conductivity is unmatched. Despite these attractive properties for the semiconductor industry, the applications of diamonds have so far been limited due to a lack of techniques capable of slicing them into thin wafers effi ciently. As a result, diamond wafers must currently be synthesised one by one, making fabrication costs prohibitive for most industries.
LASERS HOLD THE ANSWER Now, a research team from Japan, led by Professor Hirofumi Hidai from the Graduate School of Engineering at Chiba University, has unveiled a solution to this problem. T e team has developed a novel laser-based slicing technique that
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