MATERIALS, PROCESSES & FINISHES


says. “As the two components are dispensed they are mixed in the nozzle tip and dispensed on a substrate that connects a heat generating source to a heat spreader allowing for heat the be drawn.” As a two-component material,


Therm-a-form CIP 60 has an excellent flow rate and is dispensable in high volumes. The material offers vibration damping characteristics to meet the demands of challenging operating conditions, and requires no pre- mixing or weighing of components. These properties make the material particularly suitable as a thermal fill material in applications requiring heat transfer in challenging or irregular geometries, such as cooling multi-height components on a printed circuit board (PCB). Elsewhere, the material’s


combination of high thermal conductivity, flexibility and ease- of-use make it a good fit for use in automotive e-mobility systems such as converters and inverters, automotive infotainment systems like panel displays, head-up display (HDU) units and automotive advanced driver assistance systems (ADAS).


FILLING THE GAP Also on display at Electronica 2024 was the company’s new Therm-a- Gap 80LO high-performance thermal gap pad, designed for applications where the aesthetic or manufacturing issues of silicone oils are a challenge. The compressible thermal elastomer features very low oil bleed and migration characteristics and offers a typical thermal conductivity of 8W/m-K. The pad is engineered to conduct heat in gaps between a heat-generating surface like a semiconductor or battery and a heat- dissipating surface. “The Therm-a-Gap 80LO pad was


developed to be a highly reliable and long-term solution for mission- critical and high-performance electronics in nearly every market segment, including advanced computing, defence electronics, telecommunications infrastructure, and automotive,” says Ables. “LO in the product name stands for ‘Low Oil’, indicating the very low silicone oil bleed and migration properties of this gap pad. The pad has a


TIMs are essential for heat transfer away from electronic components


hardness of 60 Shore 00 and exhibits excellent stress relaxation over time, with a nearly 90% reduction in compression force after just one hour. It is designed to impart minimal stress on components such as integrated circuits and provide physical protection such as vibration dampening while maintaining effective thermal contact where conformability in gaps or rough surface texture is a concern.”


GELLING TOGETHER The third new TIM from Parker Chomerics is a high-performance dispensable thermal gel suitable for use in automotive sensors and devices, telecommunications modules, battery and energy storage systems (BESS), industrial electronics, and many other such applications. The single-component Therm-a-Gap Gel 75VT offers 7.5W/m-K typical thermal conductivity and vertical tackiness for use in demanding and mission-critical applications. “Gel 75VT was developed to


conduct heat away from electronics towards heat sinks or enclosures


and to perform reliably in vertical and/or high vibration applications,” Ables says. “The ‘VT’ suffix in the product name stands for vertical tackiness. During development, Gel 75VT was tested to a number of rigorous long-term reliability tests such as automotive vertical slump testing, high vibration testing, and telecommunications thermal material verification processes. The long- term reliability of Gel 75VT provides confidence for mission-critical applications that rely on consistent thermal performance over many years of continuous operation.” The gel requires no mixing or


secondary curing and is designed for easy application and rework. Taking ease of use one step further, the gel can be dispensed at various bond line thicknesses typically up to 0.16in (4mm) to take up gaps created by assembly or manufacturing tolerance. Together, Parker Chomerics’


new TIMs are poised to optimise electronics cooling applications across crucial industries such as electronics, transportation and alternative energy systems.


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