MATERIALS, PROCESSES & FINISHES
The Therm-a-Form CIP60 cure-in-place material
COOL IT E
Novel thermal interface materials are taking electronics cooling applications to new lows
lectronics cooling is crucial in ensuring that electronic devices operate at their optimal capacity. In addition
to averting system failure, proper cooling helps to extend the lifespan of electronic devices by preventing components from overheating and burning out, while maintaining their performance. Thermal Interface Materials (TIMs)
are designed to aid heat transfer and dissipation within electrical components by filling the gap between contact surfaces, therefore reducing thermal resistance and enabling more efficient cooling. In recent years, TIMs have continued to evolve, driven by market needs for high thermal conductivity, lower thermal impedance, new applications and lower costs. The Chomerics division of Parker
Hannifin Corporation has been active in this space for some time,
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releasing its latest trio of TIMs in November at Electronica 2024. During the show, the motion and control technologies manufacturer showcased its new thermal cure-in-place (CIP) material, gap pad and dispensable gel products. Designed to maximise thermal management performance in demanding applications, the TIMs are capable of overcoming key industry challenges such as oil bleed, vertical tackiness and the limitations of hard- curing dispensables.
COOLING OFF TIMs work by transferring heat away from electronic components and other heat-generating devices, and can also perform gap-filling duties in certain applications. One case in point is Parker Chomerics’ new Therm-a-Form CIP 60 cure-in-place material and thermal gap filler, says Phillip Ables, global product manager, DLM, in Parker’s Chomerics division.
The Therm-a-Gap 80LO high-performance thermal gap pad
“Our cure-in-place material
allows manufacturers to assemble components for a more conforming fit,” he says. “In different applications, this can potentially reduce stress as well as improve the contact and reduce contact resistance between components. While being soft, the material has excellent adhesion properties. Additional benefits include a load deflection force design, flexibility, automated dispensing and assembly for higher throughput manufacturing.” With its high 6W/m-K thermal
conductivity, Therm-a-Form CIP 60 not only provides an appealing alternative to hard-curing dispensable materials in electronics cooling applications, but also offers an improvement over standard application methods associated with thermal gap filler pads. “There are two components with the material: Part A and Part B,” Ables
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