INSTRUMENTATION • ELECTRONICS
RUGGED, FANLESS EMBEDDED SERVER
he MXCS-15xxML-C1 was designed with the target to meet the MIL-STD-810 as well as parts of the DO-160 standards. The solution is installed in a compact IP67 housing with a total of eight D-38999 connectors including a dual-fibre optical 10Gbit LAN port. MPL’s engineering approach
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is different to many other rugged solutions. The internal wiring has been eliminated as much as possible. The D-38999 MIL connectors are soldered on special MPL-designed rigid-flex PCBs. The EMI protection in each interface is integrated directly on the soldered connector PCBs. This provides the best EMI efficiency and interface quality. To interface to the standard embedded CPU board from MPL, mating interfaces
boards (ICC) have been designed. The flexible part of the connector PCBs are connected to the ICC, which is interfacing wire and cable free directly to the CPU board. With this concept the MXCS can meet almost any specification in rugged computing environments, such as the various MIL standards. The CPU boards as well as the ICC and connector PCBs can be coated and bonded to increase the robustness even further.
The heart of the system is an
Intel XEON Server chip D-1500 soldered on board. For best heat dissipation, the CPU is conductive cooled without the need of a heat- pipe or a fan.
The MXCS-15xxML-C1 comes
with numerous interfaces, such as DVI-D, USB 2.0, serial lines, LAN, 10Gbit fibre LAN as well as a wide power input. Additional expansions
(CAN, 1553, ARINC, GPS) can be done over the internal expansion interfaces such as mPCIe, m.2, PCIe or PCIe/104. These expansions can quickly and easily be integrated into the server system. This makes the solution highly flexible and enables cost-efficient customisation. l
For more information visit
www.mpl.ch
3D SCAN OF COMPONENTS BEFORE LASER CLADDING
o detect free forms and form deviations before the laser processing stage, a scanControl laser scanner from Micro-Epsilon scans the corresponding components. If required by the component geometry, this is done from several directions. Regardless of the reflection properties of the material, the laser scanner constantly provides reliable measurement values. Laser processing of components is a versatile task. It ranges from cutting
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and welding work to coating. To derive the optimum machining processes from the profile data obtained, mechanical components are measured three- dimensionally before machining. Laser profile scanners from Micro-Epsilon are used for this purpose. In laser cladding, a melt pool is created
on the surface of the component. Adding a powdered filler material creates a new, pore- free layer. The core task of the scanner is the detection of free forms as well as the recognition of form deviations before laser processing. Different sensors can be used depending on the application, such as repair, 3D printing, joining or coating and component size. The scanControl 3050-50/BL is ideally suited. This scanner offers a measuring range of 50 mm, with 2,048 measurement points per profile and a measuring rate of up to 10,000 profiles per
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second. The blue laser line enables precise measurements on metallic surfaces. The raw data is transferred directly to
the customer software, assembled into a 3D model and finally used for the path planning of the laser welding head. The nozzle can then be placed at the correct distance from the surface and guided along the calculated path. The result is a new, even and full surface. In contrast to a camera solution, laser
profile scanners enable the creation of a 3D model and are also surface- independent in terms of contrast. The higher precision, as well as the various integration and processing possibilities of the acquired measurement data, also offer significant advantages in this application. Compared to tactile measurements, the
required cycle time is considerably shorter thanks to non-contact measurements. l
For more information visit
www.micro-epsilon.com
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