February, 2012
www.us-tech.com
Meeting Today’s Die Sorting Challenges Continued from previous page
eject needles above the surface of the eject head, the speed with which the needles raise, and the height of the pickup tool for both the die pick and die place. Adjustment of these parameters works in conjunction
gripper fingers, but part way up the grippers. This ensures that die of all thicknesses can be pro cessed using this non-surface contact method.
Handling Wide Range of Die Die sorters, when used with
Eject head with array of needles for large, thin die (shown on Royce Instruments, Inc.’s DE35-ST).
with the tooling selection to ensure a quality die sort process. For pickup tools, the material,
size, and shape can be customized to meet the requirements of any die. The most common pickup tools are circular at the tip and use vacuum on the die surface for pickup. They are generally made from rubber, anti- static Vespel (hard plastic), or tung- sten carbide. Rubber tips are low cost and softer than Vespel or tungsten carbide. Many types of rubber mate- rials are available, including some with greater compliance for use with die with solder bumps on the surface (the pickup tip elastically conforms to the bumps).
ESD Protection Vespel offers good electrostatic
discharge protection for devices and is more wear-resistant than rubber. Tungsten carbide can be precision machined to accommodate the small- est die (less than 200µm square) and other complex pickup tip geometries. Channel or “collet” style pickup tips, using vacuum, only contact two of the top edges of the die. These tools are specific to a particular die size and have a shallow radius so that the sur- face of the pickup tool does not touch the die surface. These tools can be used for devices with sensitive surfaces or optical lenses that cannot be touched. However, for some devices, such
as MEMs, a collet pickup tool does not suffice due to the limited clear- ance between the pickup tool surface and die surface. In these cases, a complete non-surface contact ap - proach is needed. To meet this requirement, Royce Instruments, Inc. utilizes a unique gripper mecha- nism option on its die sorters’ pick arm. This mechanism can hold two or three Vespel gripper fingers, which contact two sides of the die, but not the die surface (similar to a pair of tweezers). The grippers are pneu- matically actuated with open and close position adjustment available. A vacuum regulator allows adjust- ment of the gripper closing force from zero to approximately 20 grams. Non-surface contact eject heads are used in conjunction with the grip- pers. These eject heads include a dull center needle which holds the die stable until the grippers close around it. This provides a reliable way to pickup MEMs devices without dam- aging the mechanical structures on the die surface. This approach works well for
even the thinnest of die. Typically the die is not gripped at the very tip of the
various combinations of the tooling presented here, allow the processing of a wide range of sensitive die, devices, and packages from all mar- ket segments. By moving from a manual to automatic process, the manufacturing engineer will no longer see problems such as exces- sive force on the die or die rotation, as a result of the die sorting process. Once a process has been established, all die will be reliably processed with
the same high quality results. To meet today’s die sorting chal- lenges, Royce Instruments, Inc. brings
Page 65
over 28 years of die sorting experience to its worldwide customer base. The company offers a semi-automatic and fully automatic system to process die as small as 150 to 200µm square, on wafers up to 300mm diameter. By utilizing a floating flexure
design for the pickup arm, die surface contact force can be drastically reduced. This, along with other process options including the non-sur- face contact gripper-finger mecha- nism, facet inspection, underside inspection, die inversion, and wafer mapping, allow Royce to deliver suc- cessful die sorting process solutions. Contact: Royce Instruments,
Non-surface contact gripper mechanism; picking die using Royce Instruments, Inc.’s DE35-ST.
Inc., 831 Latour Court, Suite C, Napa, CA 94558 % 707-255-9078 E-mail:
skinzli@royceinstruments.com Web:
www.royceinstruments.com
See us at Electronics West / MDM, Booth 425 and APEX, Booth 1641
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100