SHOW PREVIEW OFC 2017
beyond. Te portfolio addresses the high- performance analogue interfaces between electrical and optical domains, and provides solutions to meet the demanding size, power and signal integrity requirements of today’s high- speed networks, which are expanding to meet the continuously growing demand for data capacity.
www.macom.com
Fischer Connectors (booth 3807) will highlight its rugged fibre-optic interconnects, a pre-cabled product designed for maximum link performance. Te FiberOptic Series connectors are easy use, clean and maintain even in harsh environments, making them ideal for many demanding applications like energy, sensing, medical devices, defence and security, broadcast, telecom and transportation. Fischer’s FiberOptic Series features
high-end butt joint technology, and comes in singlemode and multimode variants with UPC or APC polishing. Rated to IP68 (mated) and IP67 (unmated), they offer unmatched protection against water, with a removable mono-block mate adapter. Body styles include a full fibre-optic version with one, two or four optical channels, and hybrid option with two fibre channels and two electrical contacts.
www.fischerconnectors.com
interconnect (DCI) platforms, enabling network operators to cost-efficiently scale network capacity, reduce operational complexity, and create the resilient foundation for a new generation of mobile, video, and cloud services.
www.coriant.com
Discover howMACOM(booth 1736) is increasing bandwidth density in optical networks. Leveraging deep domain experience in optical networking along with a combination of semiconductor technologies, MACOM creates innovative and smart products supporting cloud data centre, client access, metro and long-haul applications. Te company’s complete portfolio includes high-performance modulator drivers, transimpedance amplifiers, clock/data recovery circuits, crosspoints, photodiodes, Fabry Perot and distributed feedback (DFB) lasers, silicon photonics, and optical subassemblies (ROSAs and TOSAs) for enterprise and telecom optical systems operating at speeds of 100G, 400G and
30 FIBRE SYSTEMS Issue 15 • Spring 2017
Senko (booths 2584, 2811) will show its new range of Micro LC connectors. Te simple bayonet mechanism on the Micro LC connector eliminates the need for finger access to the latch mechanism, allowing connectors to be mounted much closer together than before. Attendees will
@fibresystemsmag |
www.fibre-systems.com
those based on the company’s Infinite Capacity Engine, the first multi-terabit optoelectronic subsystem, delivering the next step function in transport networking performance. In addition, Infinera has confirmed speakers at
the event, including Parthi Kandappan, Infinera SVP, system architecture, who will present on OSA’s Executive Forum Program ‘Panel 2: Trade-offs in Data Center Interconnect (DCI)’ at 11:15am on March 20, 2017. In addition, Fred Kish, Infinera SVP, optical integrated components group, will speak on MarketWatch ‘Panel V: Photonic Integration Business Case – Reality Check’ at 10.30am on 23 March.
www.infinera.com
have the opportunity to see how Senko’s unique design of Micro LC connector is ideal for behind-the-wall applications, plug-and-play modules, and on-board optics, where space saving is important. Using a conventional LC ferrule with spring-loaded design, the Micro LC connector also mates with standard LCs.
www.senko.com
Albis Optoelectronics (booth 3506) will present its extended portfolio of mounted photodiodes. In close co-operation with customers, Albis has developed complex assembly solutions that meet stringent requirements with regards to alignment precision, bandwidth and layout complexity. Te Albis avalanche and pin photodiode portfolio can now be supplied as flip-chip bonded or wire-bonded devices on customised 2D or 3D (wrap-around) carriers. For example, PS20X4 consists of an array of four, flip-chip soldered 28Gb/s lensed photodiodes that can be used as the core building block inside a 100G receiver optical sub-assembly (ROSA) module. To support the surge in demand for high-end products, Albis will double its workforce and production infrastructure during 2017.
www.albisopto.com
At OFC 2017, Infinera (booth 3259) will demonstrate its latest packet-optical products for long-haul, metro and cloud networks, including
Te 438 Series Multi-Wavelength Meter from Bristol Instruments (booth 3412) combines Michelson interferometer-based technology with fast Fourier transform analysis in order to measure the wavelength, power, and optical signal-to-noise ratio (OSNR) of as many as 1000 discrete optical signals. With features such as high accuracy and a measurement rate of 10Hz, the model 438 provides the most precise, reliable, and efficient wavelength testing to satisfy the needs of any manufacturing engineer, the company claims. It is the fastest system available for WDM testing applications, enabling reduced testing times and greater production efficiency. Te model 438 operates from 1000nm to 1680nm, to cover current testing requirements over the C and
L optical bands, and address future testing requirements over the T and O optical bands. Te 438 system measures wavelength to an accuracy as high as ±0.3pm, power to ±0.5dB, and OSNR to better than 40dB.
www.bristol-inst.com
Huber+Suhner company Polatis (booth 2239) is a supplier of high-performance dynamic all-optical circuit switches for soſtware-defined network provisioning, protection, monitoring, reconfiguration and test. Its reliable, field-proven DirectLight optical switch technology powers more than 2,000 systems in-service worldwide and forms the industry’s broadest range of transparent, bidirectional, dark fibre optical circuit switches from 4x4 to 384x384 ports. At OFC 2017, Huber+Suhner will be releasing
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