Advertorials Kemtron Introduce a new soft silicone flat
EMI gasket material A flat, sheet material, comprising a solid silicone rubber, embedded with Monel or Aluminium metal wires orientated perpendicular to its surface. Excellent RFI/EMI/EMP shielding performance is achieved as the material has a wire density of up to 140 wires/ CM2 in solid silicone providing an environmental and RFI/ EMI seal when clamped between two metallic surfaces. These wires are crimped to aid compression and are chemically bonded to ensure their retention. They will also penetrate most light oxide layers, ensuring a low contact resistance path when suitably compressed.
For applications with severe joint unevenness, low closure forces , and where greater compressibility is required, Kemtron have developed new grades 470/480 of material to fulfil a need that meets the performance of our oriented wire in silicone sponge but with improved environmental sealing qualities. We have achieved this by using a very soft solid silicone with a reduced wire count of 100 wires per cm2 the same as our silicone sponge. The advantages of these materials over silicone sponge are that we can manufacture sheet widths of 225mm with a minimum thickness of 0.8mm. Material consistency is a great advantage over silicone sponge as there is no uneven cell structure to consider that affects moisture ingress and closure force.
Kemtron Ltd Tel: 01376 348115
www.kemtron.co.uk
New congatec Server-on-Modules for real-time Xeon® processors L2Tek distributes world’s smallest
high performance ST-2022-6 converters L2Tek announces availability of a new family of SDI-to-IP emSFP™ converter modules designed to encapsulate high-performance uncompressed SDI signals into a SMPTE ST-2022-6 stream or decapsulate a ST-2022-6 stream to an uncompressed SDI signal.
Manufactured by Embrionix, the modules are the smallest of their kind available in the market and can be installed directly into IP
network routers, switches and SDI platforms. This makes it easier for broadcasters and production companies to design cost effective, flexible and scalable systems they can convey high bit rate media signals with IP (HBRMT) functionality.
The ST 2022-6 emSFP (SDI on host) has a 10GE (10GBase-LX) port for direct use with HD video switchers and routers. The ST 2022-6 emSFP (10GE on host) has SDI I/O and a 10GE (10GBASE-X) host connection for use with standard COTS IP routers and switches.
Evaluation samples and more technical information and support for customers in the UK, Nordics and Netherlands are available from L2Tek.
www.l2tek.co.uk
media processing congatec introduces new Server-on-Modules with high transcoding performance based on the latest Intel®
congatec, a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services, has introduced two new Server-on-Modules which have been especially designed for real- time media processing. The new conga-TS170 Server-on-Modules are based on the latest Intel Xeon E3-1578L and E3-1558 processors. A distinguishing feature of the new modules is the integrated Intel Iris™ Pro Graphics accelerated by 128 MB fast eDRAM and double graphics base frequency for outstanding transcoding and video processing performance. Additionally, with the Media Studio Server package they offer comprehensive software support. congatec’s new Server-on- Modules come with an extensive ecosystem including complete Board Support Packages, comprehensive driver support and instantly application-ready carrierboards and evaluation kits, simplifying individual embedded server configurations.
Edge and fog computers for industrial IoT applications are one of the two major application areas for the new Server-on-Modules. Their task is pre-processing and transcoding big data as well as managing and controlling local processes. In close proximity to the field-level such servers are highly responsive and real-time capable allowing both the horizontal and the vertical networking of any industrial IoT-connected smart sensors, actuators and complex equipment and machines. High-level media processing performance brings benefits to numerous application fields. Examples are autonomous driving, drone control, vision-based robotics as well as self-learning machines with complex Deep Learning algorithms and neuronal network structures, which also profit from the high-level media and GPGPU processing capacities of the new Xeon processors.
congatec AG
www.congatec.com
PicoCOMA9X
Computer on Module with NXP
i.MX 6 SoloX Processor PicoCOM™A9X is the latest member of the F&S form factor PicoCOM™family
All members of the PicoCOM™ product family are pin compatible and have a robust 80-pole plug connector. At a size of 40x50mm only, PicoCOM™A9X can offer the performance of Cortex®-A9-1GHz at a low price.
The module will be available for 10+ years and is therefore a perfect partner for applications in medicine and industry.
The processor is an NXP
i.MX 6SoloX (ARM® Cortex®-A9 and –M4).
SoloX is the second processor in NXP’s portfolio which supports asymmetric multiprocessing. Both cores (ARM® Cortex®-A9 and -M4) are connected to the internal bus fabric and have the possibility to access all peripherals. The advantages of the M4 core are real-time processing and the interfaces are available immediately after power on.
The PicoCOM™A9X offers up to 512MB DDR3 RAM, 1GB SLC NAND Flash and 32GB eMMC, as well as an SD-Card slot interface. Other interfaces are 2x IEEE 1588 Ethernet, 1x USB Host/1x Device, 2x CAN, I2C, SPI, 3x UART, Audio (Line In/Out) and Digital I/O.
An 16/18bit RGB interface is available for connecting displays; a resistive touch panel interface is available as well. A capacitive touch controller can be connected via the I2C interface.
The power supply is 3,3V, the power consumption is 2W typ.
Available operating systems for PicoCOM™A9X are Windows Embedded Compact 2013, Windows Embedded Compact 7 and Linux. For Linux development one can either use Buildroot or Yocto.
The porting of these operating systems on PicoCOM™A9X has been completed by the software department of F&S Elektronik Systeme.
NEON , FPU and OPENGL are available ensuring software compatibility to other
i.MX 6 application processors.
www.mansky.co.uk SBCs based on the latest 6th gen
Skylake-U i7/i5/i3 processors BVM has announced three embedded SBCs based on the 15W TDP 6th generation Skylake-U Core i7/i5/i3 processors and the Sunrise Point chipset offering high performance, intensive graphics capability, low power consumption and fanless operation. The LV-67T Mini-ITX, the LP-175 Pico- ITX and the LE-37G 3.5" embedded SBCs are suited for applications including IoT, retail POS and transaction processing, signage, kiosks, gaming machines, medical equipment and industrial automation.
All versions support the latest DDR4 2133MHz DRAM, with 32GB available for the LV-67T and 16GB for the other two designs. Intel HD520
graphics provide DirecX12, Open GL4.4 and OpenCL support across triple displays under LVDS, HDMI and DisplayPort with HD audio from a Realtek ALC252 driver.
All versions offer rich I/O capability; the actual configurations vary by part number. Up to four USB3.0 and four USB2.0 ports, either one or two SATAIII ports, one or two GbE ports, up to five RS232 and one RS232/422/485 serial ports are provided. Expansion capability includes PCI, Mini- PCI, SIM, Mini-PCIe with mSATA; again the details vary according to the specific part number. Power is from ATX or external 9-24VDC for the LV-67T, 9-24VDC for the LE-37G and 5V for the LP-175.
BVM Ltd Tel: 01489 780144
www.bvm.co.uk
Sensor protection Protecting sensors simply and securely
Sensors are used everywhere in the world. Whether they are battery driven or powered from the grid, it is important to have suitable protection for electronics. For this purpose, SCHURTER offers such SMD fuses for primary and secondary protection. These fuses stand out due to their compact design, low power dissipation and a tight time tolerance for tripping.
In order to meet the requirements of sensor protection in an optimal way, SCHURTER developed the USx line for overcurrent protection in secondary circuits. The USx line consists of six types in various SMD sizes from 0402 to 1206 and with rated currents from 50 mA to 25 A. Considerable breaking capacity as large as 600 A at rated voltages of up to 125 VAC/VDC make the chip fuses in the USx line unique in the market. The partially gold-plated contacts also have a positive im-pact on usability, storage life and the electrical qualities of USx fuses.
SCHURTER
www.schurter.co.uk
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