Innovation | electrical and electronic
E&E proves a hot spot for plastics
New materials and process technologies dedicated to the fast-growing market for LED lighting dominate poly- mer innovation in the electrical and electronics arena, particularly in the area of thermal management, which is driving development of thermally conductive com- pounds. However, integration is also a key demand and a recently announced process for producing compo- nents that combine the functionality of electrical circuitry and heat sink is also close to being used in commercial applications, while plastics compounds containing electrically conductive fi llers to provide electromagnetic shielding are gaining ground too. This article takes a look at some of the latest innovations.
Shielding solutions Luvocom ES is the latest generation of thermoplastic shielding compounds from Lehmann & Voss. The compounds contain metal fi bres in combination with other additives, says Thomas Collet, global product and marketing manager for the company’s Customized Polymer Materials business unit. Rheology is optimised for easy processing and thin walls. “This results in a much lower risk of defects in moulded parts due to imperfectly distributed fi llers in comparison to poly-
www.compoundingworld.com
While the fast growing LED market certainly grabs the headlines there are many more polymer-based innovations to be found in the
electrical and electronics sector. Peter Mapleston reports
mers and masterbatches that have been dry blended at the injection moulding machine,” Collet says. Overall shrinkage, fl ow and mechanical properties
for some Luvocom ES compounds are close to standard PC/ABS with 20% glass fi bres and parts are said to have an “attractive” surface appearance. Flame retardant packages can also be included. Another major compounder, RTP Company, says it
has noted an increased interest from the electronics market for engineered compounds that provide both thermal conductivity and EMI shielding properties. Neil Hardwick, within the company’s Conductive Products
Main image: Many compo- nents on electronic
circuit boards
require plastics with high heat
resistance, says Nilit Plastics
August 2016 | COMPOUNDING WORLD 71
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98