Solar integration takes a page from the semi wafer CSP playbook
trol, contact resistance and recombination The silicon industry continues to evolve. >22% efficiency silicon solar cells, www.
are some of the challenges in relying on this From information-based functions to physi- sunpowercorp.com.
system. Thus, new metallization processes cal measurement (MEMS) to energy genera- 4. www.renewableenergyworld.com/rea/
are emerging to meet the solar challenge. tion (solar), the demand for silicon material news/story? id=52470&src=rss
The semi packaging industry can only is constantly growing. 5. metalprices.com for bulk spot pricing
benefit from the push to find low cost, Solar technology has different demands 6. pubs.acs.org/subscribe/journals/esthag-
high throughput metallization solutions. than the IC business, but solar can take a w/2005/mar /tech/jp_solarcells.html
The main techniques that metallization are page out of the CSP toolbox and find new 7. C. Ballif, S. Peters and D. Borchert, Lo-
settling on are organic-metal printing and ways of integrating packaging technology cal Series Resistance Mapping of Silicon
plating. There is not enough data yet to into low cost, high performance solar mod- Solar Cells by Microwave Photocon-
make an evaluation of the spray printing ules. Instead of pursuing a solution within ductivity Decay Measurements, Prog.
processes, but organo-metallic complexes the cells, solar lends itself to many solutions Photovolt: Res. Appl. 2003; 11:309–317
have historically not performed as well as on the packaging side through low cost 8. M. Zimmerman, Investigation of Con-
plated metal systems. materials, thermal management, improved tact Resistance and Aluminum Spiking
However, standard plating systems interconnect and system integration. These during NiSi Nickel Mono-Silicide for-
also have limitations in terms of solar. The opportunities will allow solar to reach grid mation, http://www.physics.ohiostate.
key to superior plating performance is the parity and diminish the value of carbon- edu/~reu/03reu/ REU2003reports/
interface metal to the silicon. In effect, the based fuels. Zimmerman_final.pdf
plating must begin to approach the perfor- 9. Photovoltaics Innovations Win 2
mance of sputtering or evaporation. Light references R&D 100 Awards, www.nrel.gov/
induced and electroless technologies are 1. V. Smil, (2003). Energy at the Cross- features/0708_rd100.html
being pursued, but they may not sufficiently roads: Global Perspectives and Un- 10. SolarMagic™ Technology,www.national.
provide enough energy to initiate substan- certainties. MIT Press, 443. ISBN com/ analog/solarmagic
tial improvement in seed growth. 0262194929. 11. S.T. Cho, Direct-Energy Plating: A New
Vibrational energy approaches such as 2. techno.nikkeibp.co.jp/article/ Electrodeposition Process for Intercon-
Direct Energy Plating offers promise due HONSHI/20070328/ 129633/cs-fig1. nects, Semiconductor International
to the energy being coupled directly to the jpg On-Line, Feb 2008.
substrate and the low cost of operation of 3. D. De Ceuster, P. Cousins, D. Rose, D.
the tool itself
11
. Vicente, P. Tipones and W. Mulligan,
summary Low Cost, high volume production of
Innovation
that

matters …
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