TECHNOLOGY IN ACTION
EZ-BoardWare RFI Shield Cans H
Three-phase medium power film capacitors
A
VX Corporation, a leading manufacturer of passive components and interconnect solutions, has released the new FLB series medium power film capacitors. Packaged in a cylindrical aluminum can with terminals that enable direct, three-phase, internal wire connection, FLB series capacitors are comprised of metallized polypropylene dielectric imbued with a soft polyurethane resin. FLB series capacitors feature a dual safety system consisting of an overpressure disconnector and self-healing technology, as well as exhibit high ripple current and extremely high dielectric strength in operating temperatures spanning -40°C to +80°C.
Ideal
applications for the series include: power factor correction and output AC filtering in power converters, UPS systems, solar and wind inverters, and motor drives. AVX’s RoHS-compliant FLB series three-phase, medium power film capacitors are available in nine case sizes, six voltages spanning 230-690VAC, capacitance values spanning 3*20.3µF to 3*335µF, and
three ±20%).
AVX Tel: +33 3 80 71 75 28 Web:
www.avx.com
enter 805 capacitance tolerances (±5%, ±10%,
arwin, the leading hi-rel connector and SMT board hardware manufacturer, has expanded its popular EZ-BoardWare portfolio of surface mount PCB hardware components with the introduction of EZ-RFI Shield Cans which, when used with the company’s EZ BoardWare RFI Shield Can Clips, provide excellent RFI and EMI protection to sensitive circuitry at PCB level.
Because the cans are mounted by simply pushing them into the surface mount clips, installation costs are minimised since there is no secondary processing required. More, cans can be easily removed for inspection/repair/rework with no fear of damage to the PCB. The clips ensure secure can retention, resistant to shock and vibration. New E-Z RFI Shield Cans feature a mechanically-robust, simple five sided box design that saves cost when compared to fence and cover styles.
Harwin Europe Tel: 02392 314 545 Web:
www.harwin.com enter 806
Intel Quark SoC X1000 Processors Now in Stock at Mouser M
ouser Electronics,
Inc. is now shipping the new Intel®
Quark X1000 System on a Chip (SoC), the latest Intel 32-bit processor built for the next generation of connected devices. The Quark X1000 is the first in a new line of Intel processors designed for new applications ranging from Internet of Things (IoT) to wearables, transportation, energy, and industrial control. The new Intel Quark X1000 SoC Processors
available from
Mouser Electronics run as fast as 400MHz and are designed specifically for high performance low power applications.
The Quark is backwards compatible with previous Intel processors and software compatible with existing x86 based CPUs such as the Intel Atom™ and Intel Core™ line of processors. The Quark is 100% compatible with the Pentium® instruction set and even runs PC compatible software.
Mouser Electronics Tel: 817 804-3833 Web:
www.mouser.com enter 807
Hamamatsu Announces World’s First Watt-level High-output Photonic Crystal Laser
developed H
amamatsu Photonics K.K., in conjunction with Kyoto University’s Photonics and Electronics Science and Engineering Center and others, has the world’s
first watt-level photonics crystal laser, a next-
generation semiconductor laser light source. The group successfully demonstrated continuous room temperature
operation of the new laser, which generated output of 1.5 watts while maintaining a narrow beam spread of less than 3 degrees.
In addition, the group demonstrated the utility of the laser’s high brightness and high output by showing how it can burn through a substance through direct, lens-less irradiation.
These results are a significant milestone for laser-based manufacturing (in
Japan), as they lay the groundwork for the future adoption of this new type of laser for laser excitation, wavelength conversion, biotechnology, analytical chemistry, and other applications.
Results of the group’s research have already been published in the electronic version of Nature Photonics(
http://www.nature.com/nphoton/journal/
vaop/ncurrent/full/
nphoton.2014.75.html), and will appear in the May 2014 issue of the publication.
Portions of this research were supported by grants from the Japan Science and Technology Agency’s ACCEL Program and from the Photon Frontier Program of Japan’s Ministry of Education, Culture, Sports, Science, and Technology.
Hamamatsu Tel: 01707 294 888 enter 808 / ELECTRONICS Web:
www.hamamatsu.com enter 809 ELECTRONICS | MAY 2014 29
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