electrical & electronic | Update Barkley develops IMIW
UK-based Barkley Plastics has developed an in-mould injection welding (IMIW) technol- ogy for production of a range of fully-encapsu- lated electronic devices such as RFIDs. Developed with the
assistance of UK-based Warwick Manufacturing Group (WMG) and Austrian machinery maker Wittmann Battenfeld, the single-step production system involves the moulding of two shell components which can then be assembled around an electronic chip or insert prior to overmoulding to create a permanent hermetic seal.
special injection machine programming. WMG provided support for determining weld integrity, which can be determined in the mould using a pressure transducer system. Barkley Plastics has
trialled the technology with a number or polymers, including PC, PC/ABS, PA, PPSU and in
Barkley Plastics developed
its own sliding core tooling for the IMIW process. Wittmann Battenfeld helped with design of the production cell automa- tion, including insertion of the electronics and demoulding of finished parts, as well as
unfilled and glass-reinforced grades and all have passed required tests “with flying colours” according to the company’s technical director Maurice Cassidy. ❙
www.barkley.co.uk ❙
www.wittmann-group.com
Nano-diamond handles the heat
Finnish company Carbodeon claims to be able to increase the conductivity of thermally- conductive polymers by a further 25% without negatively affecting electrical properties using an additive based on nano-scale diamond. The improvement is said to achieved through incorporation
of a thermal filler system based on boron nitride and the company’s proprietary uDiamond additive. It claims that replacing 45 wt% of boron nitride thermal filler in a PA66 reference material with 44.9 wt% of boron nitride and just 0.1 wt% of its uDiamond additive resulted in a 25%
thermal conductivity gain. “The performance improve- ments achieved by this filler are derived from the extremely high thermal conductivity of diamond, at around 2000 W/ mK,” says Carbodeon chief technology officer Vesa Myllymäki. ❙
www.carbodeon.com
PEI used in sensor housings
US-based Advanced Sensor Technologies has switched from polyetherimide (PEI) to Radel polyphenylsulfone (PPSU) resin from Solvay Specialty Polymers for production of its high-per- formance industrial sensor housings. According to the
company, PPSU provides improved chemical resistance, mechanical strength and thermal performance for the housings, which are used in harsh operating conditions such as chemical manufac- turing and food and dairy production.
Radel PPSU offers a higher heat deflection temperature than PEI, allowing the company to offer a service temperature of 135°C. It performs better in high-pressure environ- ments and provides better resistance to acids, alkali and organic chemicals, the company says. ❙
www.solvay.com
MPC covers up with Akulon
US-based Miniature Precision Compo- nents (MPC) is using a glass and mineral reinforced grade of Akulon Ultraflow PA6 from DSM Engineering Plastics to mould covers used on hybrid electric car engines. Akulon Ultraflow is claimed to provide
up to 80% improvement in flow com- pared to standard PA6 grades used for engine covers. Shorter injection and holding times and faster crystallisation
46 INJECTION WORLD | April 2014
performance can enable cycle time reductions of up to 40%, according to DSM, while the improved flow allows wall thickness reductions of up to 20%. MPC is using Akulon Ultraflow K-FHGM24 for its covers, a grade with 10% glass fibre reinforcement and 20% mineral filler. Mould filling simulations showed the polymer would produce parts with low warpage ❙
www.dsmep.com
www.injectionworld.com
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