Materials
disassembling. With any thermally conductive material it is very important to ensure that the interface between device and heat sink is completely filled and all air is displaced. The power of the device needs to be known and assumptions need to be made about the temperature reached by the heat sink. It is possible to calculate the thermal resistance across the boundary and the equilibrium operating temperature of the device, by knowing the thermal conductivity of the heat transfer compound, the thickness of the film of heat sink compound and the contact area of the heat sink. The ever-increasing miniaturisation in electronics
means that heat dissipation problems are becoming significantly more important. Effective thermal management will often lead to
enhanced reliability and increased life expectancy of devices. Electrolube’s technical support can help designers
find the right thermal management solution for heat transfer challenges and assist with selecting formulated chemicals from their extensive portfolio for all stages of production. ●
For more information ✔ at
www.engineerlive.com/ede
Jade Bridges is with H K Wentworth Limited, Ashby de la Zouch, Leicestershire, UK.
www.hkw.co.uk or
www.electrolube.com
Fig. 3. Electrolube’s HTS and HTSP, have higher operating temperatures than their non-silicone alternatives, HTC and HTCP.
100
75 95
25
0 5
For more information ✔ at
www.engineerlive.com/ede
EL_Euro Design Engineer_185x121mm_022014_prespress 05 February 2014 09:06:12
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