Product News I Interconnection
Molex to offer future-proof end-to-end 25 Gbps channel interoperability
Supporting next-generation 100 Gbps Ethernet and 100 Gbps InfiniBand Enhanced Data Rate (EDR) applications, Molex is looking to offer design engineers a comprehensive portfolio of end-to-end, high-speed channel solutions for increased data rates with minimal crosstalk and maximum signal integrity in mobile telecom and data communications, storage and networking applications. According to Molex a typical channel for a high- speed network connection could start with zSFP+ (Small Form-factor Pluggable Plus) SMT I/O connectors receiving data (e.g., a signal) entering into the switch chassis. Designed
for 25 Gbps serial channels in high-speed Ethernet and Fibre Channel, the scalable Molex zSFP+ interconnects are able to provide optimal EMI and signal integrity. The signal could next route to a motherboard through a SEARAY board-to-board mezzanine connector. Travelling at data rates of up to 25 Gbps, the signal could pass through the midplane and daughtercard via Impact Orthogonal and EdgeLine CoEdge connectors. These connectors have been designed for a direct PCB connection, and the Impact 100-Ohm orthogonal direct right-angle male connector and daughtercard system mitigates the performance constraints of backplane and midplane connections. The space- saving Impact technology supports high-speed 25 Gbps data rates and greatly reduces airflow restrictions, cross-talk, and capacitance constraints in high-speed channels. Impact connectors feature compliant-pin technology and the lowest mating force in the industry. The EdgeLine CoEdge connector from Molex is able to offer a low profile height interconnect solution that creates minimal wind resistance in an air-cooled chassis and an electrically optimised terminal to minimise noise for high speed transmissions in excess of 25 Gbps. This scalable and cost-effective, one-piece EdgeLine connector enables designers to specify first-mate, last- break designations and shorter stubs for high- speed communications using a customisable card-edge interface.
As the signal exits the daughtercard, a zQSFP+ integrated cage and connector routes it through to a zQSFP+ breakout cable and into a
Ultra-miniature DIP switch from
C&K Components
C&K Components has developed an ultra- miniature, surface-mount DIP switch that is able to deliver consistent electrical performance and high reliability. The half-pitch TDA Series DIP switch features bifurcated contacts that provide increased electrical reliability. In addition, the switches are process-sealed for both surface- mount soldering and washable-processing, making them suitable for hand-held electronics devices, portable computer devices, and instrumentations and controls.
The RoHS-compliant TDA Series is available in two termination styles, S-termination (Gullwing) and J-termination (Bend). The single pole, single throw (SPST) DIP switch is available in multiple positions, including 2, 4, 6, 8 and 10 positions. The TDA Series DIP switch features a contact rating of 24 V DC, 25 mA (switching state) and 50 V DC, 100 mA (steady state). The TDA Series
www.cieonline.co.uk
router/switch. Supporting next-generation 100 Gbps Ethernet and 100 Gbps InfiniBand Enhanced Data Rate (EDR) applications, the Molex zQSFP+ interconnect solution provides 28 Gbps data rates for up to 4km with thermal cooling, signal integrity, EMI protection and the lowest optical power consumption in the industry.
Once at the router, a NeoScale 28 Gbps
mezzanine connector could direct the signal to the motherboard and into the backplane to another Impact solution, so the signal is delivered quickly and cleanly. One of the highest performing mezzanine connections on the market, the recently launched Molex NeoScale mezzanine connector features a unique and patent pending triad design to group signals into electrically optimised structures. The triad design not only offers a designer flexibility in mixing and matching different triad configurations based on the needs for high speed differential pairs, high speed single-ended transmission, low speed control links and power requirements, but it also optimises the channel electrically, helping to provide a very clean signal channel. The NeoScale connector’s PCB attach method comes in both Molex’s award winning Solder Charge SMT attachment technology and the option for press-fit attach. The triads conform to a mirror image footprint to provide ease and flexibility of PCB routing in one or two PCB layers to minimise a designer’s PCB thickness, in turn decreasing PCB cost.
Molex Incorporated |
www.molex.com
DIP switch provides a maximum contact resistance of 100m?. Operating temperature ranges from -40ºC to +85ºC. The TDA Series switches are available in tape and reel or tube packaging.
C&K Components |
www.ck-components.com
Components in Electronics March 2012 23
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