Vendor View
The enhanced approach for metal lift off processes
Siconnex is a equipment manufacturer for the semiconductor and related industry with a focus on wet batch and single wafer spray. Siconnex systems provide small footprints, high safety, full automation and improved throughput. Here they outline product advantages impacting the MEMS industry.
SINGLE WAFER SOLVENT applications are becoming more relevant for the MEMS industry. As a consequence Siconnex has expanded its activities and now offers Metal Lift Off, Resist Strip and Polymer Removal processes on the Siconnex Vertical 200 platform. The process head on the Siconnex
Vertical 200 platform is especially designed to run solvent applications such as Metal Lift Off, Resist Strip and Polymer Removal. The Substrate Face- Down Technology eliminates the risk of wafer contamination. Dry wafer handling throughout the system minimizes maintenance. Up to 6 process modules are arranged in a stacked chamber design, keeping the footprint (with integrated chemical conditioning system) smaller than 4m2. Based on this configuration a typical Lift-Off application achieves a throughput of 125wph. Wafer sizes up to 8-inch are
processed in this system.
Advantages InSitu Lift-Off Chamber Compared to other available systems on the market, the Siconnex Vertical 200 SOLVENT has an on the Siconnex Vertical 200 platform enabling the tool to perform both steps in one chamber, a complete soaking process as well as the final High-Pressure Lift-Off cycle. The soaking step is done by utilizing
dedicated spray nozzles, up to a pressure of approximately 2 bar. Using the mechanical force of this stream, the soaking time can be reduced by over 75%. The subsequent High-Pressure step eliminates residues and cleans the surface completely. The required pressure (up to 150 bar) can be adjusted in the recipe.
Substrate Face-Down Technology Wafers are loaded face-down into the process chamber, where they are held by a vacuum chuck. A N2-Purge completely protects the wafer backside from splash-backs caused by the high pressure step.
Due to Substrate Face-Down
Technology, all residues will be kept away from the wafer surface by gravity. In addition, this technology prevents the wafer from scratches caused by metal residues.
Process Qualification Siconnex qualifies all processes in its laboratory in Salzburg. The cleanroom is equipped with all Siconnex systems being offered to the industry – Produce 200 Acid for batch spray wafer acid applications, Produce 200 Solvent for batch spray wafer solvent applications and Vertical 200 Solvent for single wafer solvent applications. Currently, more than 50 000 wafers were processed in the Vertical 200
Solvent to develop and qualify Metal Lift Off, Resist Strip and Polymer Removal processes. Upcoming laboratory activities are the qualification of contactless handling (Bernoulli chuck) and the development of the Vertical 200 Acid for single wafer acid tasks.
Siconnex – Wet Spray Expert Founded in 2002, Siconnex is headquartered in Salzburg/Hof, Austria, and operates via a customer support network, with subsidiaries in France, Malaysia and Taiwan. Siconnex provides surface
preparation equipment and processes, including wet batch wafer spray and single wafer spray systems for MEMS, III-V Semiconductor, Wireless, Power, Energy Harvesting, WLP, Data Storage and Logic industries.
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www.euroasiasemiconductor.com Issue I 2012
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