news digest ♦ LEDs
especially in the shorter UV wavelengths, was hindered because the materials used in the epoxy LED lens degraded the lifespan of UV LEDs to less than 5,000 hours,” explained Kay Fernandez, Product Technology Manager at Lumex. “Recent technological developments have allowed the epoxy lenses to be replaced by a robust TO-46 package with a glass lens, making it possible for QuasarBrite UVs to last 10 times longer- with life spans of over than 50,000 hours.”
In addition to enhanced life span, QuasarBrite UV LEDs provide several key benefits compared to alternative technologies like CCFLs. QuasarBrite UV LEDs provide a uniform beam pattern. To match this performance CCFLs would require a secondary lens resulting in additional cost and space investment. Additionally, QuasarBrite UV LEDs do not use the hazardous mercury material found in CCFL technology and are more durable in their design, thereby significantly reducing maintenance costs. Finally, Lumex’s UV LEDs have up to 70% lower energy consumption than CCFLs. These factors combined allow Lumex’s QuasarBrite UV LEDs to provide up to a 50% cost savings compared to CCFLs.
“Because of significant cost and performance benefits UV LEDs provide over alternative technologies such as CCFLs, there is a dramatic growth in demand for UV LED technology worldwide,” explained Fernandez. “Lumex now offers a total of six standard UV wavelengths (355, 365, 377, 385, 405 and 415nm) as well as an almost limitless number of custom options to meet the needs of this growing market.”
The new 355nm, 365nm and 377nm QuasarBrite UV LEDs feature a 80° viewing angle and operating temperature range from -40°C to 100°C. Samples of these devices are available immediately from stock. Standard and custom production lead times range from 18-20 weeks. Pricing is dependent on quantity ordered, and is approximately $20 to $28 per unit in production quantities dependent on size and quantity ordered.
Pressureless Silver Sintering Technology from Henkel
Henkel Electronic Materials has announced its success with a revolutionary silver (Ag) sintering technology that enables high volume production of modern power packages in a process that does not require pressure
In its market debut, Henkel’s Ag sintering capability has been designed into Ablestik SSP2000, a high reliability die attach material well-suited for use with power modules such as IGBTs and high power LED products.
Sintering is a process in which particles are joined together by heating the material in a sintering furnace below its melting point until there is particle adhesion. Conventional Ag sintering is achieved by applying both heat and pressure to the material, or device, until the metal joint is formed. The drawback to the pressure application technique in semiconductor packaging, however, is its volume limitation, as devices must be processed individually on capital-intensive die bonding systems. With Ablestik SSP2000, because the silver particles are joined via a unique surface tension mechanism, the pressure requirement is eliminated and the material can be cured in a standard batch oven at a temperature as low as 200 degree centigrade. In addition, Ablestik SSP2000 can be processed on standard die bonding systems, eliminating the need to reinvest in specialist equipment and making the transition from existing materials simple, fast and cost-effective.
“The ability to now exponentially increase UPH from traditional silver sintering techniques at roughly 30 units per hour to a remarkable 6,000 units per hour with the Henkel technology is incredible,” enthusiastically explains Henkel’s Dr. Michael Todd, Vice-President of Product Development and Engineering. “Now, semiconductor packaging specialists canhave high volume and high reliability with a silver sintering material.”
While high UPH is a central advantage of Ablestik SSP2000, even more notable is the material’s thermal resistance and reliability. When compared to high-lead soft solders, which are the current material of choice for power semiconductor devices, Ablestik SSP2000 has far superior power cycling
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www.compoundsemiconductor.net August/September 2011
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