photonics opinion
rhombus4
photonic integration, and perhaps this is a
call to further explore the area between
analog device integration and digitized
integration for photonics. Two important
trend graphs are discussed below that
address photonic integration both from a
component as well as a functional
standpoint (using wavelength).
Although the component devices have
changed in nature and structure over time
for PICs in fiber-based communications, the
capacity that a single die can deliver
doubled every 2.2 years during the 90s with
time division multiplexed (TDM)
communication networks. This is seen in
Figure 6: the two round dots, lower left, for
EML devices. Wavelength division
multiplexed (WDM) integration on a single
die allows for even more rapid growth using
the pure III-V material system.
Figure 4: Monolithic hybrid PIC platform combining CMOS and wafer bonded III-Vs (IMEC, Figure 6 also shows the logarithm of data
Ghent, OIDA Photonic Integration Forum, Oct 2008). capacity in Gbps in the first year of
deployment for commercial devices with
solid diamond data points. Research devices
detecting properties of III-Vs. An example integration toward the Holy Grail of and their predicted rate of development are
is shown from European researchers in digitization. shown with open diamond data points.
Figure 4.
8.0 The Holy Grail for photonics The trend for future performance is a log
7.0 Has the reliability of PICs integration is coming scale extrapolation from the reported
advanced for digitization? To better access the potential of reaching highest capacity III-V prototypes reported in
As with any new technology, reliability needs the Holy Grail for photonic integration, 2004 and 2008. There are a number of
to be proved beyond a shadow of a doubt roadmaps need to be generated…derived ways trend graphs can be shown, and in
in order to carry traffic. The progress with by the industry and academia. There are Figure 7, the trend towards large scale
InP PICs has been terrific to date, and is presently only a few trend graphs for photonic integration is shown to be
probably ready for digitization if and when
the process technology advances to the
level of maturity needed. Indium phosphide
is now proving to be an excellent platform
for integration as can be seen in Figure 5.
Currently deployed InP PICs implemented
by Infinera to support 100 Gbps WDM per
chip have demonstrated more than 100
million service hours with no failures. This
puts the FIT rate for a > 50 functional
component, PIC, at < 10 FIT for a 60%
confidence level. This compares well to field
data from discrete commercial 980 nm
Pump Chips: 74 FIT @ 60% CL (H. Pfeiffer
et al, OFC 2002) or 5 FIT (G. Yang, et al,
JDSU, JWA30, OFC 2007). Improved
reliability in PICs is being seen as one of the
strongest drivers to grow photonic
Figure 5: The FIT rate at 60% confidence
over time as PICs continue to be
employed in communication networks
(Infinera)
30
www.compoundsemiconductor.net October 2009
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