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US-Taiwan partnership invests $6m in semiconductor fabrication
> Semiconductor
US DOE announces $2.2m for joint Japanese research projects in high-energy physics > Physics
The US Department of Energy (DOE) announced $2.2m for 11 collaborative research projects in high-energy physics that involve substantial collaboration with Japanese investigators. For more than 40 years, collaboration
between US and Japanese scientists has enabled progress in some of the most challenging areas in high-energy physics. Working together, researchers explore the universe at the smallest and largest scales, from the most elementary constituents of matter and energy to the nature of space and time. The long history of US-Japan cooperation includes many significant milestones, such as the contributions by Japanese collaborators on the Collider Detector at Fermilab experiment at the Fermilab Tevatron Collider to the discovery of the top quark in 1995. High-energy physics continues to play a major role in nurturing top scientific talent. “Our office is proud of its track record
of collaborating with scientists in Japan in improving our understanding of the universe,” said Regina Rameika, DOE Associate Director of Science for High
Energy Physics (HEP). “We’re excited to continue this fruitful collaboration with our Japanese colleagues and enable discovery science that will also benefit society.” The projects submitted to DOE were
selected by competitive peer review under the DOE National Laboratory Announcement for the US-Japan Science and Technology Cooperation Program in High Energy Physics. Each proposed US-Japan collaboration had its Japanese principal investigator apply to a coordinated call by the High Energy Accelerator Research Organization (KEK) in Japan for support in the collaborative activity. Final selections were determined with strategic coordination between the DOE and KEK, with each providing funding to the successful US and Japanese awards, respectively. Total funding is $2.2m for projects lasting up to three years in duration, with $1m in outyear funding contingent on congressional appropriations. The list of projects and more information can be found at
https://science.osti.gov/hep.
Through a new partnership, the US National Science Foundation and the National Science and Technology Council of Taiwan (NSTC) have invested $6m in six joint projects for fundamental research on advanced semiconductor chip design and fabrication. The new awards will support
collaborations between US and Taiwan-based researchers on the design and fabrication of innovative semiconductor chips using the advanced processes available in Taiwan’s semiconductor foundries. NSF has provided $3m to the US researchers involved. The partnership is guided by the Memorandum of Understanding and Implementing Arrangement for Cooperation in Advanced Semiconductor Chip Design and Fabrication, signed by the American Institute in Taiwan and the Taipei Economic and Cultural Representative Office in the United States. “Through this pilot
Algorithmic breakthrough unlocks the path to sustainable technologies
> Materials science > Sustainability
A new tool may allow scientists to use widely available elements to replace scarce or toxic elements in existing materials, as well as to find new materials that could meet the challenges of net zero. Published in the journal Nature,
researchers at the University of Liverpool have shown that a mathematical algorithm can guarantee to predict the structure of any material just based on knowledge of the atoms that make it up. Developed by an interdisciplinary team
from the university’s departments of Chemistry and Computer Science, the
algorithm systematically evaluates entire sets of possible structures at once, rather than considering them one at a time, to accelerate the identification of the correct solution. This breakthrough makes it possible
to identify those materials that can be made and, in many cases, to predict their properties. The new method was demonstrated on quantum computers that have the potential to solve many problems faster than classical computers and can therefore speed up the calculations even further.
partnership that expands access to state-of-the- art facilities, science and engineering funding agencies will enable researchers in the US and Taiwan to advance knowledge and prepare the workforce for future semiconductor chip design and fabrication,” said Susan Margulies, NSF assistant director for engineering. Advanced chip designs promise to lower energy consumption of microelectronic devices and systems, reduce the environmental impacts of manufacturing and increase speed, capacity and security. Applications include AI, communications, computing and sensing.
Summer 2023 Scientific Computing World 37
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