PRODUCT UPDATE
PHOTONIC SYSTEMS Semi-automated photonic debonding tool
PulseForge has launched the PD 300 SA, a semi-automated photonic debonding tool that delivers clean wafer separation at a significantly lower cost than lasers. The system enables semiconductor advanced
packaging for R&D and low-volume customers. It leverages high-intensity pulses of light in conjunction with PulseForge’s reusable, light- absorbing layer carriers to debond temporarily bonded materials for wafer thinning, hybrid bonding, and micro-LED transfer. PD 300 SA offers improved margins, industrial
scale, throughput and shorter lead times, allowing manufacturers to package semiconductors at lower prices. Suitable for both wafer-level and panel- level packaging, it can debond warped wafers without expensive warpage adjustment hardware
POSITIONING EQUIPMENT Maglev nanopositioning stage
PI has developed a demonstrator nanopositioning linear translation stage at its Silicon Valley tech centre based on magnetic levitation (maglev) – a frictionless motion technology that uses magnetic fields to levitate and propel objects (best known for its use in high-speed trains). The magnets in the base of the demonstrator
are a set of electrically controllable coils that manipulate the stage’s lateral motion, vertical motion and pitch, yaw, and roll. A high- resolution position-sensing system is also included for feedback to the motion controller. Since no mechanical bearings restrict the motion of the linear stage platform, all six degrees of freedom are available to correct any bearing insufficiencies, with a powerful multi-axis controller. Such stages could
have applications in numerous areas, from semiconductor tests and metrology, to photonics, optics, and high-resolution microscopy. Thanks to its multi-dimensional controllable motion, this technology does not produce particles – making it suitable for cleanrooms – nor does it suffer from wear or tear. And in contrast to air- bearing stages, no supply of compressed air is required.
www.pi-usa.us
SPECTROSCOPY
or process changes, which makes it ideal for low- volume and R&D applications. PulseForge says its photonic debonding systems
offer a substantially lower cost of ownership than incumbent industry alternatives, and that they each provide a clean, ash-free process.
www.pulseforge.com
VCSEL arrays for dynamic illumination and sensing
To address growing demand for optoelectronic subassemblies facilitating optical sensing in consumer electronics, Coherent has unveiled a module architecture for ultracompact dynamic illumination and sensing with backside- emitting VCSEL arrays. The technology enables ultra-compact
pattern projectors, flood illuminators, and tightly integrated sensing subsystems. It relies on an innovative flip-chip assembly of backside-emitting VCSEL arrays on application-specific integrated circuits (ASICs) and supports the integration of photodetector arrays. Coherent says the flip-chip approach eliminates the parasitic inductance from bond wires, improving the depth resolution and accuracy of time-of- flight sensors in consumer electronics. It adds that backside illumination optoelectronics enable not only superior electrical performance of flip-chip assemblies, but also greater optical integration with polarisation- locking and beam-shaping features embedded in the optoelectronic device.
www.coherent.com
Infrared edge- emitting laser diode
MICROSCOPY Confocal Raman microscope
Renishaw has added fluorescence lifetime imaging microscopy (FLIM) functionality to its inVia confocal Raman microscope. In partnership with Becker & Hickl, experts in time-correlated single photon counting (TCSPC), the system combines Raman and FLIM in one instrument. This can overlay both FLIM and Raman images with pixel- to-pixel correlation, thus increasing understanding of samples across a range of applications. FLIM provides insight into molecular
interactions and can be performed at least 10x faster than Raman imaging, while Raman spectroscopy boasts high chemical specificity and high-resolution chemical images. The combination of techniques is therefore ideal for rapid identification of regions of interest by FLIM, followed by chemical and structural characterisation by Raman imaging. For FLIM
www.electrooptics.com | @electrooptics
Ams Osram has introduced an infrared edge-emitting laser diode in a cost-effective radial plastic package for improving long- distance ranging applications and enabling easier optical integration – the SPL PL90AT03. The laser has a peak wavelength of 905nm,
data analysis, comprehensive software is included with multi-exponential, incomplete and shifted- component analysis models. The software also includes proprietary phasor analysis to distinguish lifetime populations. Fluorescence lifetime and Raman images can be directly overlaid due to the use of the highly accurate Renishaw MS30 high speed encoded stage for both imaging modalities.
www.renishaw.com
a spectral bandwidth (FWHM) of 5nm, and can produce laser pulses ranging from a few to a hundred nanoseconds. Beam divergence is 12° (parallel) x 25° (perpendicular), enabling efficient beam shaping with its 110µm aperture. It can produce optical peak output power in a 30ns pulse of 75W at maximum forward current of 25A. The diode consists of three vertically stacked
emitters in a single laser die mounted inside a low-cost radial plastic package, making it suited to high-volume applications. It can be used in technology relying on distance measuring and can produce detailed depth maps for 3D optical sensing and simultaneous localisation and mapping (SLAM) systems.
www.ams-osram.com
May 2023 Electro Optics 37
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