Roadmap 2019/20
without a host PC. With its very small size, low weight and power consumption, the Firefly DL camera is ideal for embedding into mobile, desktop, and handheld systems.
www.flir.com
Following the launch of its IDS NXT Rio and Rome cameras, which are able to perform AI- based vision tasks directly ‘on the edge’, IDS Image Development Systems intends to extend the capabilities of its imaging portfolio further in the coming year. One of the firm’s main focuses will be to
offer an easy-to-use industrial AI camera solution that won’t require any programming knowledge to use. Tis includes the
A statement from Mark Williamson, managing director of Stemmer Imaging UK: ‘By introducing application-specific subsystems that can be used in a number of different markets, in 2020 Stemmer Imaging will be providing system integrators with tools to save time and reduce risk when addressing end-user applications. Te first of these will be the InPicker 3D bin picking system. Tis can use a variety of 3D imaging techniques to recognise and determine the position of even complex objects with very irregular shapes and multiple structures that are randomly distributed in a container and directly interface with a variety of robots. ‘Stemmer Imaging’s core competencies
of the supply of both machine vision components and bespoke imaging subsystems for OEMs will also be
development of a smart GenICam vision app that will allow users to upload camera features they have created to IDS NXT devices, and use them as if they were part of the standard IDS NXT camera functionality. With 3D camera technology playing an
important role in automation tasks, such as bin picking and quality control, IDS also intends to extend its Ensenso product range, further incorporating on-board data processing to reduce PC overheads. In addition, the firm will extend its portfolio of uEye cameras with new sensors and new functionality, and add more than 100 new USB3 Vision models to its CP and SE camera families.
https://en.ids-imaging.com
Photoneo introduced a number of new products and solutions throughout 2019, including a solution for automated 3D model creation, an automated mobile robot (AMR)
named Phollower 100, and updates to its PhoXi Control soſtware and Bin Picking Studio. Upcoming is the release of the MotionCam-
3D, a high-resolution and high-accuracy 3D camera. Photoneo also started several interesting projects and collaborations with customers this year, which will see development throughout 2020.
www.photoneo.com
Sick will develop a variety of application- specific cameras based on the programmable 2D and 3D vision sensor portfolio, in combination with the Sick AppSpace ecosystem. Tese will have a dedicated interface, ready to solve a specific task, for example fine positioning of stacker cranes, robot guidance for picking applications, quality inspection of printed labels, presence inspection in consumer goods and quality control of connectors in electronics. Moreover, a new concept will be introduced
that allows programming customers to plug-in their own tools directly into a configurable vision sensor and extend its functionality. Sick will also add competitive entry-level models with improved resolution and performance to the 2D and 3D vision portfolio. In particular, new 3D camera models will be launched next year based on Sick’s ROCC technology.
www.sick.com/more-than-a-vision
Lucid Vision Labs plans to expand its Atlas family with more sensor choices and incorporate the higher speeds of NBase-T. Its current 5GigE Atlas camera offers faster
40 Imaging and Machine Vision Europe • Yearbook 2019/2020
@imveurope
www.imveurope.com
complemented through providing subsystems for wider vertical markets. ‘Using its technical expertise, Stemmer
Imaging adds value in every aspect of its business. Vision component sales are frequently backed up with additional services, including system design.’
www.stemmer-imaging.co.uk
frame rates, small size and excellent price- performance. It features a TFL-lens mount (M35) which supports large format sensors such as the 31.4 megapixel Sony Pregius IMX342 global shutter CMOS. Te camera line is designed for applications requiring high bandwidth over 5GBase-T PoE. By the end of the year, Lucid also plans to
offer a time-of-flight camera module on an embedded board with MIPI output using the Nvidia Jetson TX2 and its own processing library. Te firm’s current compact time- of-flight camera, Helios, based on Sony’s DepthSense IMX556 sensor, provides high 3D depth precision and industrial reliability at an attractive price. Both product lines will have expanded
feature sets, such as support for multi-camera configurations.
www.thinklucid.com
Basler will continue to broaden its portfolio with new lighting solutions, cost-effective lenses and several new camera models. For example, the firm will enlarge its Ace 2
camera portfolio and launch several models with the latest sensors, as well as expand the products in its Boost series based on
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