Feature: Embedded
market. Nevertheless, developers should ensure that their architectural approach retains enough technology independence to allow a pivot, should the need arises. Malleability is key.
Building systems around connected data T e next innovation zone to AI and ML is an evolution of a well-established feature: connectivity. Connected platforms for monitoring and support data transfer have a predictable roadmap; however, we are now also beginning to see platform designs for advanced connectivity. T e suite of tools available to quickly
analyse and derive business value from data collected during development is extensive and provides a new innovation zone for embedded products. Here, the need is to understand the workfl ows of data analytics and design embedded platforms that enable data to be produced and analysed by such tools. Of course, provisions must be made to create an appropriate analytics engine that has the capacity to do this and which is aligned to the needs of the application. Consider the value of capturing user
data during extensive consumer or clinical trials that can be used by cloud analytic engines to translate into comprehensible behaviour insights or to identify anomalies earlier in the design cycle. To support this value chain, platforms must have the means to monitor key consumer interactions and the logging functions needed to store and retrieve usage data for later, offl ine analytics. Furthermore, to maximise the accuracy of the derived insights, these features must all be implemented in a platform that does not aff ect the product’s form or operation. Development programs should build
in these capabilities from the outset, essentially validating functionality with users throughout the engineering processes, which will ultimately result in building a better product.
Malleability and rapid response T e third and fi nal innovation zone is underpinned by business rather than technological needs. Embedded platforms must now support the type of rapid
26 May 2024
www.electronicsworld.co.uk
Smart materials will have embedded sensors and transmitters
Even for customised garments, materials will be ‘smart’, with embedded sensors
iterations needed to deliver rich feature- sets to market and maintain consumer engagement, which means increasingly supporting high-level general-purpose programming languages. T is may mean additional platform hardware and costs, but this will greatly speed up delivery times.
Innovating for tomorrow Innovating for tomorrow requires looking at business and product development
holistically, and innovation zonal thinking can facilitate this process. It means creating an embedded platform that is accommodating and malleable enough to help develop relevant products in the face of great technological change and thus allow future-ready innovations that will future-proof businesses. When it comes to innovation, corners
can’t be cut. Investment in embedded technology is a critical tool for business resilience in this age of fl ux.
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