ENGINEERING & AEROSPACE
Sensors measure coplanarity of wafers in hybrid bonding and perform multi-segment
measurements on superconducting strip The production of superconducting strips for power applications requires the highest precision and the greatest possible material protection.
T
ypically, 12 mm wide stainless steel strips are processed with a nickel alloy, which are cut into several narrow partial strips – such as 3 or 4 mm wide segments, separated by gaps of only 0.5 mm. As the belts are also provided with sensitive PVD coatings, the width and segment measurement must be carried out on a non-contact basis and with high precision.
PLANARITY TESTING IN HYBRID BONDING
In hybrid bonding in semiconductor manufacturing, exact planarity of the wafers is crucial to ensure stable bonding processes. Capacitive distance sensors from Micro-Epsilon enable high resolution measurement of shape deviations on wafers and provide measurement data for adaptive levelling of the bonding units. Hybrid bonding is an advanced joining technology in semiconductor production in which two wafers or chips (dies) are directly connected to each other via copper contact surfaces, which eliminates the need for conventional solder balls. In modern die-to-wafer (D2W) or wafer-to- wafer (W2W) hybrid bonding, real-time planarity measurement is a key factor for process reliability. Capacitive distance sensors play a central role
here by enabling non-contact measurement of shape deviations on wafers, for example, due to deflection, twisting or local warping. In this way, the sensors control the planarity of the wafers and
Capacitive distance sensors from Micro-Epsilon enable non-contact measurement of shape deviations on wafers, for example, due to deflection, twisting or local warping.
provide essential measurement data for adaptive levelling of the bonding units. Inline planarity control before bonding Depending on the measurement task, sensor
arrays scan the surface of the upper and lower wafer and record local elevations, depressions, inclinations or the entire deflection. The measurement data is incorporated into an active position correction of the wafer stages. If height
differences are detected, the bond unit can be precisely aligned in the Z-axis, for example, using piezo-actuators or precision axes. For very small chips, segmented surfaces on the chuck are also used, which can be levelled locally.
REAL-TIME QUALITY CONTROL FOR MAXIMUM PROCESS RELIABILITY
Using the compact, high performance optoCONTROL 2700-40 LED micrometer from Micro-Epsilon, the strip is measured immediately after cutting in the running process. With a width of 12 mm, the continuous strip is recorded in the measuring field of the optical micrometer. Due to the ‘Multi-segment’ preset, both the total width and the width of the individual partial strips can be measured precisely. The 0.5 mm narrow gaps between the segments are also reliably detected and monitored.
MAXIMUM PRECISION WITH MINIMUM WASTE
Using the compact, high performance optoCONTROL 2700-40 LED micrometer from Micro-Epsilon, the strip is measured immediately after cutting in the running process.
20 July/August 2026 Irish Manufacturing
The optical precision micrometers offer a number of decisive advantages for demanding cutting and coating processes. As the measurement is carried out on a non-contact basis, the sensitive nickel and PVD layers are not mechanically stressed – there is no risk of scratches or deformations.
https://www.micro-epsilon.co.uk/
www.irish-manufacturing.com
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