Advertorials
RAM squeeze sends buyers back to basics
Embedded systems expert, Direct Insight explains how to navigate AI RAM shortages and price instability
Direct Insight, the UK-based technical systems integrator & value-added reseller of system-on-modules (SoMs) & other embedded systems, has noted that the ongoing pressure on memory supply, driven by exponential demand from AI infrastructure, is adversely impacting developers of embedded systems – and is offering insight and expertise to help designers and buyers navigate this challenge. The compound effect of AI- fuelled supply pressure and geopolitical uncertainties has seen both lead times and prices rise steeply, particularly for higher-performance, higher-bandwidth DDR5 RAM, resulting in specification, design and procurement hurdles for embedded development teams. “The rapid boom of AI technology has sent shockwaves through the semiconductor memory market,” notes David Pashley, co-founder & Managing Director at Direct Insight. “Skyrocketing demand has ramped up pressure on high performance DDR5, and that trickles down to DDR4 and so on, with prices and lead times spiralling as inventory is bought up. Then, crucially, production is shifted from commodity DRAM capacity to higher-margin HBM (High Bandwidth Memory), which is primarily used in high- performance computing (HPC) and AI hardware to help overcome the ‘memory wall’ bottleneck. This just makes things worse for the embedded/IoT world.” Direct Insight has always focused on helping development teams to select and specify the optimal system-on-module hardware – allied to the right software and OS tools – for their embedded design projects, along with support and services, allowing customers to focus on applying their domain knowledge to deliver excellent differentiated products.
Direct Insight
Highly rugged GAPS & HAPS aerospace proximity sensors from Honeywell now available through Powell Electronics
Now available through Powell Electronics, the supplier of connectors and more for high-rel applications including defence, aerospace and industrial, are the GAPS (General Aerospace Proximity Sensors) and HAPS (Harsh Application Proximity Sensors) proximity sensors from Honeywell. Both sensor series incorporate Honeywell’s patented integrated health monitoring functionality, however the products have some technical differences that allow them to be used in various aerospace applications. The GAPS series are configurable, non-contact, hermetically sealed devices designed to sense the presence or absence of a target. They can be used in less harsh areas of application with some differences of electrical and environmental characteristics when compared to HAPS. HAPS Aerospace Proximity Sensors are configurable, non-contact, hermetically sealed devices designed to sense the presence or absence of a target in harsh duty aircraft applications. The GAPS and HAPS series proximity sensors provide on/off outputs and can be configured with an optional health monitoring output to the host system. The sensing mechanism is based on the familiar Eddy Current Killed Oscillator (ECKO) principles. However, Honeywell has also designed and implemented the patented FAVCO (Fixed Amplitude Variable Current Oscillator) technology, which enables the Honeywell sensors to have the health monitoring (IHM) features. In addition, both GAPS and HAPS series help to reduce downtime and maintenance costs due to a unique circuit that can detect any internal failures and display a fault output instead of a false positive or false negative. For the customer, this delivers the best performance with a lower overall cost over the life of the aircraft.
Powell Electronics
www.powell-europe.com
Pickering Introduces LXI High-Current Switching Family for Signals up to 80 A and 300 V
New 60-191 family combines high-current power switching and low-current sense switching in a compact 4U form factor
Pickering Interfaces, a leading supplier of modular signal switching and simulation solutions for electronic test and verification, has introduced the 60-191 LXI high current & sense SPST switching family. The company’s highest-current switching products to date, the new family can switch signals up to 80 A and 300 V while simplifying distribution, sequencing, and management of multiple high-current power supplies in automated test systems.
The 60-191 family is available in four standard configurations, combining up to twenty 40 A and four
80 A hermetically sealed SPST-NO contactors with a complementary number of 1 A SPST relays for sense lines. High-current and sense-line connections are via standard front-panel screw-terminal connections. Custom relay combinations and alternative connector options may be requested. Installed between multiple high-current power supply units (PSUs) and a device or system under test, each unit can programmatically connect and disconnect each PSU’s positive and negative outputs and their associated high- and low-sense lines. Engineers can control every relay independently or operate two high-current and two low-current relays as a group with a single command, simplifying the switching of the four connections commonly used by a PSU.
“High-current switching in automated test systems is often implemented as a custom assembly using contactors and digital output modules,” said Steven Edwards, Head of Product Management at Pickering. “The 60-191 family provides fully tested, easily maintainable LXI alternatives in standard 4U enclosures, with the switching capacity, control features, and software support needed to integrate high-current supplies more quickly.”
Pickering Interfaces
www.cieonline.co.uk www.pickeringtest.com
www.directinsight.co.uk
Advantageous smart metering solution from NeoCortec and Semtech demo’d at Electronica India
See combination of NeoMesh wireless mesh networking protocol & LR2021 multi-modulation transceivers on Booth H3.G11
NeoCortec, manufacturer of the
ultra-low-power bi-directional wireless mesh networking protocol stack NeoMesh, will demonstrate the effectiveness of its NeoMesh wireless mesh networking protocol in smart meters at the upcoming Electronica India exhibition, 16-18 September, at the BIEC exhibition centre, Bengaluru. NeoCortec is working with high-performance semiconductor, IoT systems and Cloud connectivity service provider, Semtech Corporation. Visitors to Semtech’s booth, H3.G11 will see how the combination of the proven NeoMesh wireless mesh technology and Semtech’s LR2021 transceiver which supports FLRC, LoRa and FSK modulation perfectly addresses the demands of large-scale smart metering networks. With a native DLMS®/HDLC adaptation layer, NeoMesh provides a scalable, secure and reliable wireless platform, while FLRC is ideally suited to dense meter deployments, with LoRa also available when longer hops are required. Comments Thomas Steen Halkier, CEO, NeoCortec: “Analysts agree that the smart energy metering
market in India is growing significantly, by between 10% and up to 30% CAGR in the next 10 years. Even at the lower end, that represents a huge revenue opportunity, but one which needs proven, reliable, and effective communications on a massive scale. The combination of Semtech’s multi-modulation IC technology and our NeoMesh protocol, which facilitates virtually unlimited scalability, low power operation and simple installation with self-healing, is perfect for this application. We look forward to meeting potential eco-systems development partners at Electronica India.”
NeoCortec
Pickering reed relays proven to have 88% lower thermal EMF enabling compactness and precision Errors avoided; integrity of measurement maintained
Pickering Electronics, a leading manufacturer of high-performance reed relays, has published new comparative test data showing that the company’s compact reed relays produce substantially less thermal EMF than competing products. This is important, especially in miniaturized low voltage systems, as microvolt-level offsets can become a meaningful source of error. Pickering’s 4mm pitch Series 120 relays, for example, produced a final thermal EMF offset magnitude of approximately 46µV, compared with approximately 403µV for the comparison relay — around 88.5% lower. Commented Robert King, Reed Relays Product Manager at Pickering Electronics. “As components become smaller and test systems become more densely packed, engineers need to understand the errors that the switching components themselves can introduce. Our testing showed that the Series 120 produced around 8.7 times less thermal EMF offset than the comparable 4mm-class relay we tested. For low-level measurements, reducing that unwanted voltage helps the switching system preserve the signal being measured.” For applications such as semiconductor test, automated test equipment, precision data acquisition and
low-level signal switching, a relay should not simply fit the available space. It should also help preserve the integrity of the signal being measured. Compact devices, such as Pickering’s Series 120 which occupy a footprint of just 3.9 x 3.9 mm, permit close stacking while retaining the benefits of reed relay switching, including high insulation resistance, low leakage, low contact resistance and long operating life. The new test data, which is detailed in an article titled ‘Not all high density Reed Relays perform the same...’, demonstrates that reducing PCB footprint does not necessarily require accepting higher thermal EMF in the switching path.
Pickering Electronics
www.pickeringrelay.com
Power Integrations Demonstrates World’s First 2200 V GaN Technology for Next-Era High-Voltage Power Systems
Industry-first 2200 V PowiGaN™ technology enables higher power density, greater efficiency and safer and simpler system architectures for AI data centers, EVs, photovoltaic and HVDC infrastructure
Power Integrations (NASDAQ: POWI), the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced that PowiGaN™ gallium-nitride (GaN) technology is now rated at up to 2200 V, far exceeding the voltage capabilities of all other commercially available GaN technologies. This breakthrough positions PowiGaN as the leading technology solution for high-voltage data centers, EVs, renewable energy and HVDC infrastructure as they leverage higher-voltage bus architectures in search of greater power density. “Our 2200 V PowiGaN technology provides substantial voltage margin for emerging high-voltage power systems while enabling the high switching frequencies required to maximize power density,” said Jennifer Lloyd, president and CEO at Power Integrations. “Emerging applications include next-generation AI data centers, where industry roadmaps point toward 1500 V distribution architectures, as well as future EV battery and auxiliary power systems operating at increasingly higher output voltages (48V). This milestone breakthrough extends the reach of GaN into voltage ranges traditionally served by SiC, enabling a compelling high-frequency alternative for applications such as solar, HVDC and advanced industrial power conversion.”
Power Integrations Components in Electronics
www.power.com September 2026 45
www.neocortec.com
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