Aerospace, Military & Defence Focus
High-performance connectivity solutions for aerospace and defence applications
By Smiths Interconnect, a Molex company A
erospace and Defence system designers face growing pressure to achieve higher performance in increasingly compact form factors. For
applications in these industries, from radios to drones and satellites, the miniaturization of components such as RF chip attenuators and high frequency interconnects is becoming crucial for technology development and to meet the demanding requirements of defence applications. Chip attenuators are electrical components used in amplifier circuits, receivers, up/down converters, phase- matched arrays, and switching applications to attenuate the power level of the pass-through signal, without significantly degrading the integrity of that signal. They are available in different frequency ranges, attenuation values, power ratings and package configurations.
“The defence market is looking for attenuator products with higher performing broadband and a smaller footprint,” said Dave Raymonds, global product manager for board level devices at Smiths Interconnect, a Molex company. “Usually, an attenuator would be used for a lower frequency and when a higher frequency was required, a different attenuator would be used. With today’s technology, you can use one
attenuator that will work on all customer applications instead of using three or four different types of attenuators, reducing the bill of materials and offering a more cost-effective solution. Our TSX series is cost-effective, whilst still delivering a broader frequency range DC to 50 GHz and an excellent power rating (one to three watts, depending on the value that the customer chooses), all in a small 0604 package size that is surface mountable.”
During the attenuator design process, Smiths Interconnect utilizes industry- leading
simulation tools. The company uses a thin-film manufacturing
process that enables a more compact design. The thin-film design combines broadband performance and power handling in a compact package, helping engineers address space constraints in
high-density RF systems. The alumina thin film substrate processing has been around for over 40 years and is known to be capable of working in harsh environments. The growing use of drones in defence
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applications is increasing demand for compact, high-
performance RF components, and the TSX series is suitable due to its compact size. Spring probe interposers from Smiths Interconnect are engineered to provide reliable signal integrity and long-term performance in demanding electronic applications. Designed to provide a robust and repeatable connection, these solutions help manufacturers overcome the challenges
associated with traditional
connector technologies,
particularly in high-density and high- frequency environments. Their architecture is designed to ensure consistent contact force, excellent durability, and reliable operation across multiple mating cycles. Among the latest innovations in the spring probe technology portfolio is the new EZiCoax, a single-piece, solderless RF coaxial solution specifically developed to create a compliant RF interface between two printed circuit boards (PCBs) capable of performing up to 40 GHz. By eliminating the need for soldering, EZiCoax simplifies assembly processes, reduces manufacturing complexity, and enables easier maintenance and replacement, ultimately helping to lower overall system
costs. According to the company, the compliant contact design accommodates tolerances and misalignment whilst delivering excellent insertion, return and crosstalk characteristics, helping to minimize signal interference and preserve signal quality in densely packed electronic systems.
EZiCoax interposers are also available as standard single-row configurations, with 2-, 4-, and 8-way options, each offered in three height variants. The standard offering enables scalable signal distribution and compact integration, allowing engineers to integrate high- performance RF connectivity into space-constrained applications without sacrificing electrical performance, while also benefiting from quick turnaround times. EZiCoax interposers support clean signal routing with minimal loss and impressive impedance control, supporting consistent high-frequency signal transmission communication platforms while helping reduce total cost of ownership.
Combining mechanical compliance, solderless integration and high-frequency performance, EZiCoax interposer solutions are designed for demanding aerospace and defence applications, including radar, strike and interceptor missile systems, satellite communications and phased-array antennas.
https://www.smithsinterconnect.com Components in Electronics September 2026 27
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