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Cadence accelerates system innovation with Integrity 3D-IC Platform
CADENCE DESIGN SYSTEMS has announced the delivery of the Cadence Integrity 3D-IC platform, which is said to be the industry’s first comprehensive, high-capacity 3D-IC platform that integrates 3D design planning, implementation and system analysis in a single, unified cockpit. The Integrity 3D-IC platform underpins Cadence’s third- generation 3D-IC solution, providing customers with system-driven power, performance and area (PPA) for individual chiplets through integrated thermal, power and static timing analysis capabilities. Chip designers creating hyperscale computing, consumer, 5G communications, mobile and automotive applications can achieve greater productivity with the Integrity 3D-IC platform versus a disjointed die-by-die implementation approach, according to Cadence. The platform provides system planning, integrated electrothermal, static timing analysis (STA) and physical verification flows, enabling faster, high-quality 3D design closure. It also incorporates 3D exploration flows, which take 2D design netlists to create multiple 3D stacking scenarios based on user input, automatically selecting the optimal,
final 3D stacked configuration. Furthermore, the platform database supports all 3D design
High-precision voltage reference IC provides very-low drift for extended-temperature automotive applications
types, letting engineers create designs at multiple process nodes simultaneously and perform seamless co-design with package design teams and outsourced semiconductor assembly and test (OSAT) companies that use Cadence Allegro packaging technologies. Dr. Chin-Chi Teng, senior vice president and general manager in the Digital & Signoff Group at Cadence, said: “As the industry continues to move toward different configurations of 3D stacked dies, the new Integrity 3D-IC platform lets customers achieve system-driven PPA, reduced design complexity and faster time to market.”
Extended-temperature- range voltage reference ICs for automotive and industrial applications require low drift, high reliability and high performance. MICROCHIP TECHNOLOGY has released a high-precision voltage reference (Vref) IC that meets these needs at a cost-effective price. The new MCP1502 is an AEC-Q100 Grade 1 (-40°C to +125°C
operating temperature range) automotive- qualified Vref with a maximum temperature coefficient of 7ppm/°C. “Microchip looked at the top four aspects that customers were requesting in a Vref and made a product that combines high reliability, small package size and high performance at a very cost-effective price,” said Fanie Duvenhage, vice president of Microchip’s mixed-signal and linear devices business unit. “This combination of features at this price is unmatched by competitors, especially when you add our experience in
serving customers in the automotive and aerospace industries who require robust products for harsh environments.” The MCP1502 is based on the already- proven MCP1501 Vref architecture, which has been in the market for more than five years. Packaged in a small six-lead SOT-23, the MCP1502 is suitable for a wide variety of industrial, automotive and aerospace applications that require a high level of reliability. The MCP1502 is available in most popular voltage level options from 1V to 4V.
6 October 2021
Components in Electronics
www.cieonline.co.uk
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