Aerospace, Military & Defence
Power density, commercial components and 3D printing: Top challenges for 2021
New research from Future Facilities – developer of the 6SigmaET thermal simulation software – has unveiled the top thermal challenges and trends faced by the aerospace industry in 2021
C
onducted as a roundtable discussion, the research brings together thermal engineering experts from some of the world’s leading aerospace
companies, including Ten Tech LLC, CMC Electronics, Thales Group, Physical Optics Corporation (POC) and Future Facilities. Key conclusions from this discussion have been released as a free report: Thermal Focus: Areospace 2021.
According to these industry experts, the biggest challenge facing the aerospace industry in 2021 is the need for ever more functionality to be embedded onto compact, more highly-engineered solutions. This complexity is resulting
in a higher power density, running a greater risk of thermal complications and overheating. To prevent such problems, the experts identified liquid cooling and cold plates as the most viable solutions currently available to aerospace engineers. The second key challenge identified by the panel is an uptake in the use of commercial components that are not specifically rated to the limit required for extreme aerospace environments. To overcome this — and ensure the reliability of their designs —aerospace engineers are relying on ever more advanced CFD simulations, running components through numerous parametric variations in a huge variety of different environments.
The Future Facilities report also revealed that aerospace engineers are now turning to 3D printing early on in the design process, as a faster, more flexible, and more agile way to create prototypes. According to the report, “Eventually, developments in 3D printing will ensure that engineers will be able to print materials for volume use in real-life scenarios.” This trend, however, requires a whole new way of working, something which many engineers are yet to adapt to.
Commenting on these findings, Chris Aldham, product manager at Future Facilities says, “For most electronics, thermal faults can be frustrating and cause product delays or recalls. But in the aerospace industry, the consequences of a thermal failure can be catastrophic. “Accurate thermal management is vital to ensuring the safety and reliability of aerospace designs, with electronics
being regularly exposed to the harshest environments, temperature fluctuations and extreme weather conditions. Our Thermal Focus report explores these challenges, offering the latest expert advice from those working within the aerospace industry. Through these insights, we hope that engineers can make better decisions when it comes to the thermal management, simulation and overall performance of their electronic designs.”
Following the roundtable, Future Facilities has released the key findings of the discussion as an e-book that aerospace engineers can use to contribute to their understanding of these key issues and their decision-making processes.
To download a copy of Future Facilities ‘Thermal Focus: Aerospace’ report, visit:
6sigmaet.info/thermal-simulation- for-aerospace
Smiths Interconnect flies high on F-35 aircraft
A
ll military programmes are valuable contracts to secure as they are typically long-term commitments that will generate stable future revenue for the
businesses. The Lockheed Martin F-35 Lightning II (previously known as Joint Strike Fighter/ JSF) programme falls into this category, dating back to the late 1990s when the need for a 5th Generation aircraft began to evolve. The F-35 Lightning II is a family of single- seat, single-engine, all-weather stealth multirole combat aircraft that represent a quantum leap in air dominance capabilities. It is the first 5th generation multi role aircraft to reach service, offering significant updates over previous generation jets. Intended to perform superior air dominance, F-35 are also able to provide electronic warfare and intelligence, surveillance, and reconnaissance capabilities. Integration and interoperability between allies have also been a key driver in the technology development.
14 March 2021
Smiths Interconnect has been involved in the programme for more than 20 years, supplying hundreds of different interconnect devices including high reliability technologies, from RF components and high-speed/power/ density/filtered connectors to integrated microwave assemblies.
“We proudly supply different connectivity solutions to different customers that are destined for use in the F-35 aircraft,” says Paul Harris, president at Smiths Interconnect. “Our products and technologies are renowned to ensure the performance, reliability, safety and productivity that are paramount in this most advanced multi-role fighter in the world”.
Smiths Interconnect’s connectivity solutions for the F-35 aircraft include: • High power circulators embedding used on the Communications, Navigation, and Identification (CNI) system and integrated microwave assemblies used on
Components in Electronics
the Electronic Warfare (EW) system, both embedding TRAK technology
• Power connectors with Hypertac hyperboloid contacts used on aircraft power systems
• Custom interposers with IDI spring probes used on the radar system
• High reliability attenuators with EMC technology also used on the radar system
• Discrete filters embedding Lorch technology and used on the CNI system
• EMI/EMP filtered connectors with Sabritec technology used in power distribution, power panels and battery chargers In addition to the above, Reflex Photonics, which was recently acquired by Smiths Interconnect and complements its product offering with the addition of core fibre optic capabilities, is developing optical transceivers for use in the programme.
smithsinterconnect.com
www.cieonline.co.uk
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