Front End | News Global survey results reveal power system design trends M
olex, the electronics and connectivity specialist, has completed a global survey of 824 qualified design engineers
and managers to better understand top power-system design experiences, challenges, opportunities and attitudes that are enabling or inhibiting the development of critical power- system designs.
According to 94% of those polled, understanding how to work with power is a critical requirement, with 83% asserting power is one of their greatest design challenges. While nearly three-quarters of the participants strive to increase energy efficiency in their power-system designs, more than half report simultaneously addressing efficiency, cost, capacity and performance monitoring requirements.
Energy efficiency (73%) and functional safety (66%) were the most frequently reported design considerations, closely followed by signal and power interference (57%), battery requirements (49%), along with system and device miniaturization
(47%). Addressing harsh environments (41%) and environmental noise (38%) also were cited as important priorities taken into consideration in system designs and implementations. The most daunting obstacles are cost effectiveness (56%), safety (51%), thermal management (48%), electromagnetic interference (EMI) (45%), reliability over time (44%), power integrity (40%) and compliance (36%).
An abundance of design priorities and challenges continue to fuel the need for both custom and off-the- shelf solutions, according to 72% of those surveyed, underscoring the need for power expertise among design engineers and power-solution providers. Respondents ranked the most impactful improvements as battery performance (34%), materials advancements (30%), more efficient thermal management (29%), and battery lifetime (27%).
Additionally, 60% of those polled agree that higher efficiency demands will drive
power-design innovations, along with advancements in battery technology (51%), higher-power voltage consumption demands (49%), wireless connectivity (42%) and miniaturization (40%).
New board-to-board connector technology I
nterconnect specialist manufacturers EDAC, in conjunction with OpenLX SP Ltd, have launched their latest board-to- board connection technology, Clipzin. Clipzin, the patent-pending PCB- mounted edge connector allows simple fixing of single board modules, such as
the Raspberry Pi Pico, to a host PCB. As a surface mount connector, Clipzin simplifies manufacture and facilitates easy and rapid connection and disconnection of sub modules, while the retention clip ensures nothing shakes free during use. This is said to make Clipzin suitable for
the development environment, whilst also providing reliability in mass production applications.
The Clipzin connector, fitted to the host PCB and hailed as a modern successor to the card-edge connector, mates directly with the PCB by making use of castellated
Molex commissioned Dimensional Research to carry out the survey.
https://www.molex.com/en-us/trends- insights/power
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