Supplement: Power
Figure 3 — Factorized Power Architecture (FPA) factorizes the power into the dedicated functions of regulation and transformation. Both of these functions can be optimised and deployed individually to provide a high-density and high-efficiency solution.
Unleashing the power of the processer
Delivering enough power to the processor today needs innovation to try to get ahead of the status quo. New ideas, architectures, topologies and technologies are the path to a more reliable, scalable power delivery network. The Vicor Factorized Power Architecture (FPA) is the foundation for delivering more efficient power for today’s unprecedented high-performance computing demands.
The Vicor FPA divides the task of a power converter into the dedicated functions of regulation and transformation. A high-efficiency, high-density solution is achieved by separating them and optimising them individually. FPA in conjunction with the Sine Amplitude Converter (SAC) topology underpins several innovative architectures that can help unleash the full power of today’s high- performance processors.
Vicor power converter technology takes advantage of a Factorized Power Architecture that not only optimises the power converter efficiency but also enables
very low PDN losses associated with low- voltage, high-current power delivery to the PoL (ASIC or a CPU or a GPU etc.) Lateral power delivery is a technique where the two current multipliers (Vicor VTM modules) flank the north and south side or the east and west side of the processor. This technique is preferable for load currents of ~800A at 0.8V nominal with an associated 70µΩ of PDN at 100°C. Using these numbers, we can compute ~45W of power loss. A heat sink that covers both the 2.8mm tall current multipliers and the processor as shown in the picture would be a good thermal solution. This architecture is excellent for powering graphics accelerator cards (OAM or otherwise), networking ASICs and APUs used in hyperscale data centres or supercomputer cabinets.
The lateral-vertical power delivery technique is similar to lateral power delivery, but with this difference: only 70 per cent of the power is delivered laterally using the current multipliers that flank the sides of the processor. An additional current multiplier on the bottom side of the
processor will deliver the remaining 30 per cent of the load current directly to the processor BGA. The hybrid of lateral and vertical achieves a reduction in PDN loss by almost a factor of four! This technique also frees board space to accommodate a second high-current rail (aux) or HBM memory rails on the top side of the board around the processor.
Vertical-lateral power delivery, on the other hand, takes advantage of pushing >50 per cent of the load current through additional current multipliers on the bottom side of the processor. This technique enables a further 50 per cent reduction in PDN loss compared to the lateral-vertical approach. A 1200A design can now realize a PDN resistance of a mere 10µΩ, resulting in fewer than 14.4W of power loss. In this case, heat sinks can be placed on both the top and bottom sides of the load as space permits. This architecture is especially effective for applications that cannot afford power components on the top side of the board in order to accommodate high-speed signal routing from the periphery of the ASIC. Examples
are CPO, NPO and networking / broadband communication devices. Vertical power delivery is the ultimate solution in terms of delivering very high current at low processor core voltages with the lowest PDN resistance. In this case, current multipliers and bypass capacitors are stacked on each other to form an integrated power module (geared current multiplier) that can be mounted directly underneath the processor by displacing the bypass capacitor bank. Vicor GCMs are custom-built devices that map the current multiplier pinouts to the AI processor BGA in addition to being able to provide all the bypass capacitor needs within the module itself. This technique opens up the top floor of the PCB for high-speed signal routing from the periphery of the processor to realise a solution with the highest signal integrity. Applications such as CPO (co- packaged optics, networking processors) and high-speed signalling ASICs can take advantage of this power delivery technique. The Vicor architectures are flexible enough to be adapted to a wide variety of high-performance computing solutions. Vicor solutions can reduce motherboard resistances up to 50x and processing power pin count more than 10x. Leveraging a Factorized Power Architecture (FPA), Vicor minimises the “last inch” resistances with patented solutions combining lateral power delivery (LPD) and vertical power delivery (VPD). All enable processors to achieve previously unattainable performance levels to support today’s exponentially growing HPC processing demands.
We believe the FPA architectures are unmatched in current density and in reducing power losses across the PDN. Also, in our opinion, the proprietary architectures, topologies and small module size are unique in the power industry. And for the next- generation processors to operate at full capacity they need power solutions that can adapt, scale and deliver high-density power. Robust, reliable power modules in conjunction with innovative topologies are essential in dynamic systems where power requirements change rapidly. AI, machine learning and edge-computing will never have enough power for tomorrow using traditional power architectures. To meet that perpetual need you need to innovate today and be prepared to adapt and scale for tomorrow using modular power.
Open Compute Project and OCP are registered trademarks of the Open Compute Project.
Figure 4 — Leveraging FPA, Vicor minimizes the “last inch” resistances with several patented solutions involving lateral power delivery (LPD) and vertical power delivery (VPD). All enable processors to achieve previously unattainable performance levels to support today’s exponentially growing HPC processing demands.
www.cieonline.co.uk
FPA is a trademark of Vicor Corporation
www.vicorpower.com
Components in Electronics February 2024 35
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62
