Advertorials New Lattice mVision Solutions Stack accelerates
low power embedded vision development Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, has extended its position as a global provider of FPGA-based embedded vision solutions with the introduction of the Lattice mVision™ solutions stack. The complete solutions stack includes the modular hardware development boards, design software, embedded vision IP portfolio, and reference designs and demos needed to implement sensor bridging, sensor aggregation, and image processing applications. The Lattice mVision solutions stack accelerates and simplifies the implementation of embedded vision systems such as machine vision, ADAS, drones and AR/VR for the industrial, automotive, consumer, smart home, and medical markets.
Industry analyst firm Grand View Research forecasts the global machine vision market will reach over $18 billion by 2025.
The Edge AI and Vision Alliance is committed to fostering the adoption of embedded vision in new products. Jeff Bier, the Alliance’s founder, said, “Manufacturing inspection was one of the first markets to widely adopt computer vision. Today, embedded vision is expanding into a wide range of industrial applications, such as automated assembly and inventory. Many of these applications demand small, low cost, low power solutions. I applaud Lattice Semiconductor’s continuing investment in innovation not only in chips, but also in solutions stacks, such as sensAI and mVision, that help developers more easily integrate smart vision capabilities into their product designs.”
www.latticesemi.com
OMC’s new hermetically-sealed FDE851HLBF infra-red fibre optic emitter optimises long-term reliability in
challenging environments Specialist 850nm device delivers signal integrity with high intensity beam
OMC, the pioneer in optoelectronics design & manufacture, has released a hermetically-sealed 850nm fibre optic transmitter diode which delivers a high intensity output for coupling into multimode fibres even in challenging environments. Designed for applications where long term reliability is paramount, this device is highly specialised with very few similar products available on the market globally. It suits a wide range of fibre optic applications including datacomms, sensing, encoding, instrumentation and signalling, ensuring speed and integrity of signal over a long operating life.
The FDE851HLBF 850nm emitter features a hermetically- sealed TO-can body with glass optical window that helps protect the device internals from atmospheric conditions. The device features fast rise/fall times allowing high speed operation in the tens of MHz, and contains integral micro-optics which focus the beam to a very narrow point which delivers efficient coupling into multimode glass optical fibres as small as 50µm, achieving a typical launch power of 30µW at 100mA into 50/125 fibre.
Many fibre-optic emitters make use of a clear plastic cap which is pressed on to the device header. While this provides a degree of physical protection to the LED chip, wire-bond and internal optics, it is unusual for such a cap to provide a hermetic seal, meaning that the potential long-term effects of environmental characteristics such as humidity on the device internals must be carefully considered in applications where long service-life is important. By contrast, the hermetically sealed housing of the FDE851HLBF eliminates this variable, as air from the operational environment cannot reach the internal components.
omc-uk.com Power Integrations’ SCALE-iDriver for SiC MOSFETs
achieves AEC-Q100 automotive qualification Compact and robust isolated SiC MOSFET driver incorporates active clamping and <2 µs short-circuit turn-off time
Power Integrations (Nasdaq: POWI), the leader in gate-driver technology for medium- and high-voltage inverter applications, today announced that its SIC118xKQ SCALE-iDriver™, a high- efficiency, single-channel gate driver for silicon carbide (SiC) MOSFETs, is now certified to AEC-Q100 for automotive use. Devices can be configured to support gate-drive voltage requirements of commonly used SiC MOSFETs and feature sophisticated safety and protection features.
The SIC1182KQ (1200 V) and SIC1181KQ (750 V) SCALE- iDriver devices are optimized for driving SiC MOSFETs in automotive applications, exhibiting rail-to-rail output, fast gate
switching speed, unipolar supply voltage supporting positive and negative output voltages, integrated power and voltage management and reinforced isolation. Critical safety features include Drain to Source Voltage (VDS) monitoring-, SENSE readout, primary and secondary Undervoltage Lock-out (UVLO), current-limited gate drive and Advanced Active Clamping (AAC) which facilitates safe operation and soft turn-off -under fault conditions. AAC in combination with VDS monitoring ensures safe turn-off in less than 2 µs during short- circuit conditions. Gate-drive control and AAC features allow gate resistance to be minimized; this reduces switching losses, maximizing inverter efficiency.
By pairing the SCALE-iDriver control and safety features with its high-speed FluxLink™ communication technology, Power Integrations delivers a revolution in gate-driver IC technology compared to opto-, capacitive- or Si- isolated magnetic couplers. The combination dramatically improves isolation capability, and enables safe, cost-effective designs for inverters with very few external components up to 300 kW.
Technical information is available from the Power Integrations website at
www.power.com/products/scale-idriver-ic-family/sic118xkq/
www.power.com Nexperia CEO Frans Scheper retiring, Xuezheng
Zhang (Wing) becomes CEO of Nexperia On March 24, 2020, Nexperia announced that CEO Frans Scheper has decided to take early retirement and will step down as Nexperia CEO and Management Board Member per March 25, 2020. At the same time, Xuezheng Zhang (Wing), currently Chairman of the Management Board of Nexperia, will assume the role of CEO.
Frans Scheper will continue to serve as an advisor to the Chairman for a period of time to help achieve a smooth transition and provide continuity. The Board of Nexperia wishes to express its profound gratitude and respect for the achievements of Frans Scheper as CEO of Nexperia (and previously in his role as General Manager of BU Standard Products at NXP Semiconductors). During his leadership the company became an independent world-class leader in its markets and achieved a record high turnover and profitability.
Frans Scheper indicated: “I am proud of what Nexperia has become and will miss the team. At the same time, I have decided not to seek a prolongation of my four-year tenure. Now is the time for Wingtech to decide on Nexperia’s future leadership.”
Xuezheng Zhang (Wing) indicates: “Frans has been key to the success of Nexperia. On behalf of the Board I want to thank him for what he has been for the Company. I am determined to work closely with the Executive Management Team. And I am happy Frans will help me in the next months as Special Advisor.”
In December 2019, Wingtech completed the acquisition of 79.98% of Nexperia with 26.854 billion CNY - the largest semiconductor acquisition in China's history and the first time for a Chinese company to acquire a world-leading semiconductor company.
www.nexperia.com Pickering Electronics launches smallest
HV reed relay Minimum 1500V stand-off; mini SIL/SIP packaging
Pickering Electronics, the reed relay company which has pioneered miniaturization and high performance for over 50 years, has launched industry’s smallest high voltage relay. Housed in the miniture SIL/SIP package, new Series 131 reed relays have a footprint of just 12.5mm x 3.7mm and a height of 6.6mm and deliver a minimum stand-off of 1500V.
Featuring a choice of 3, 5 or 12 volt coils, with optional internal diode, Series 131 reed relays are available in the 1 Form A (energize to make) SPST N.O. configuration, and can switch up to 0.7 amps, 10 watts. Devices are ideal for cable testers, mixed signal/semiconductor testers, backplane testers, high voltage instrumentation, in-circuit test equipment or other HV applications.
Commented Keith Moore, CEO, Pickering Electronics: “Pickering Series 131 miniature SIL reed relays utilise vacuumed, sputtered ruthenium reed switches which have a superb low level performance, making them an excellent choice where a wide range of signals are involved. The range is based on our long-established Series 113 style of plastic package that incorporates an internal mu-metal magnetic screen to enable high packing density, and Pickering’s SoftCenter® construction which protects the reed switch.”
www.pickeringrelay.com Exclusive deal with JJ Micro gives Transonics
access to wide range of triacs & thyristors One million parts in stock; cost-effective, high quality equivalents to STMicro and NXP (WeEn)
Following the signing of an exclusive deal with JJ Micro, the Chinese producer of discrete and power semiconductors, Transonics, the ethical distributor that has built a reputation for providing a wide range of value-added services tailored for individual customers, is now holding one million triacs and thyristors in stock at its UK warehouse. Many of these parts are drop-in replacements for leading brands such as STMicro and NXP (WeEN Semiconductor).
Transonics’ extensive UK inventory includes JJ Micro’s internally-isolated tab Triacs ranging from mAs up to 40A, with sensitive data recurring currents. JJ Micro’s range of Triacs extends to 1400V and products - where not held in stock - are available on a 6-8 week lead time as opposed to 20 weeks plus.
Comments Daniel French, MD at Transonics: “JJ Micro is the third largest manufacturer of Triacs in the world - the largest in China – and fully-approved to international quality standards. So with products from established brand names on variable leadtimes, finally, there is a credible, qualified alternative available.”
Also available from JJ Micro and in stock at Transonics are diodes, MOSFETs, protection devices, thyristors and transistors.
www.transonics.com
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