FEATURE PCB testing
AN INNOVATIVE APPROACH TO TESTING
Choon-Hin Chang, Product Manager, Keysight Technologies, explains how to optimise the testing process during the high-volume manufacture of low complexity PCBs
E
lectronics have become ubiquitous today, with the emergence of connected products integrated into various aspects of our lives, such as internet of things (IoT) devices, consumer medical devices, and automotive electronics. These products share a common characteristic — high-volume productions, yet low challenge for manufacturers in keeping up with the production rate while testing boards at scale, necessitating a more cost- these products at scale. Manufacturers are under pressure to
revamp their manufacturing processes, reduce costs, and improve production timelines to meet the increasing demand for electronic devices. Consequently, the in-circuit testing processes applied to these products must also adapt and align with these dynamic industry demands. The imperative now is to produce
electronics at a lower cost and achieve multifaceted challenge encompasses streamlining manufacturing processes, trimming operational costs, and accelerating production cycles. This approach necessitates an intricate interplay of innovative methodologies and advanced technologies that optimises the in-circuit testing procedures needed for ensuring the quality and functionality of electronic products.
One key aspect of ensuring high-quality
production of low-complexity printed circuit boards (PCBs) hinges on the testing process, which is crucial for boards that programming. The conventional testing protocol for such boards typically involves multiple test stations, encompassing and functional testing. However, this methodology is unsuitable for high- volume production due to its constraints on test throughput and the high costs associated with multiple test stations. One way to overcome testing challenges is to adopt the PCB panelisation manufacturing technique. Using highly
32 February 2025 | Automation
panelised boards has become a common technique in manufacturing, improving throughput and increasing production volumes. Low-cost electronics are also usually smaller and lower in complexity, so multiples manageable size.
In PCB panelisation, manufacturers create one board from several boards and assemble them to form a single array. This technique boards into a panel of manageable size, making assembly line. The boards that make up the panel enable operators to load just one panel to test all boards simultaneously. During the breakout process following assembly, the panel divides into separate PCBs, a procedure known as depanelisation. The individual boards can be readily depanelised or separated from the array for packaging or installation into products. Assembly of low-complexity boards in
production is often rapid, necessitating quick turnaround times for testing to meet the production rate.
Examples of high-volume, low-complexity
board devices across various industries: • Automotive electronics • Medical devices • IoT devices • Mobile devices
Some advantages of PCB panelisation include saving time and money, improving increasing output. A parallel test method enables testing multiple boards simultaneously. This approach of parallel panel testing facilitates in-circuit tests to meet high-volume production demands
For example, if a single board takes six seconds to test, meeting the high-volume production demands necessitates a throughput of four boards every six seconds, totalling
2,400 boards per hour. To achieve the necessary throughput, the manufacturer faces two options: • Purchase four testers, which would demand • Invest in a single tester capable of testing all four boards in parallel Testing four boards sequentially using one tester would require four times the single-board test time, totalling 16 seconds. However, testing four boards in parallel reduces the overall test time to approximately six seconds. This method represents a test time savings of 10 seconds over the testing of four boards sequentially. High-volume, low-complexity PCBA testing
programming, and functional testing to keep up with high production volumes. Massively parallel board testing can test multiple boards at the same time using multiple testing cores. Given their simpler and smaller board designs, low-complexity products can accommodate 20 boards on a single manageable-sized panel. In- circuit testers capable of massively parallel testing are with test cores to execute tests for all boards in the panel in parallel. This approach integrates Massively parallel testing can also lead to an
increase in the density of panel testing. Parallel tests a greater number of boards simultaneously on a single panel. Consequently, there is a reduction in the requirement for additional in cost savings and enhanced production scalability. Overall, massively parallel testing provides advantages over standard parallel testing, especially in high-volume manufacturing. This is an extract of a longer article. You can
read the full story at:
www.automationmagazine. strategies-for-testing-high-volume-low-
Keysight Technologies
www.keysight.com/gb/en/
automationmagazine.co.uk
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