NEWS
LXI MEMs- based optical fibre switches
P
ickering Interfaces has introduced the 65-280 (matrix) and 65-281
(multiplexer) plug-ins for its LXI 65-200 platform. The 65- 28x plug-ins feature a range of high-density configurations up to 16x16 (matrix) and 32:1 (multiplexer) for a single plug-in. The new matrix and MUX devices utilise MEMS technology, using micro- mechanical mirrors to steer the optical signal, as opposed to optical prism devices. This reduces operation time, extends service life and reduces physical size. The 65-280 plug-ins have five different matrix options - 2x2, 4x4, 5x5, 8x8 & 16x16, while the 65-281 plug-ins are available in 1:1 (SPST), 2:1, 4:1, 8:1, 16:1 & 32:1 multiplexer variants. Each family can have multiple banks of smaller switch sizes per plug-in, dependent on switch size and interface connector type. To cater to most applications, the products are available with either single-mode (9/125), multi-mode (50/125) or multi- mode (62.5/125) fibre. A choice of connectors - FC/APC, FC/PC, SC/PC, LC or ST - enables the most suitable interface to be selected for the application. Optical switching suits
applications in the telecommunications sector, such as signal routing of high-speed signals in a network infrastructure where minimising signal latency and preventing errors is
essential.
www.pickeringtest.com
EPC launches new eGaN technology E
www.epc-co.com
PC has launched the 80V, 4mOhm EPC2619 - a new generation of eGaN devices that have double the power density compared to EPC’s previous generation of products. The EPC2619 has an RDS(on) of just 4mOhms in a tiny, 1.5mm x
2.5mm, footprint. The maximum RDS(on) x Area of the EPC2619 is 15mΩ*mm2 – five times smaller than 80V silicon MOSFETs. The typical RDS(on) x QGD, which is indicative of power losses
in hard-switching applications, is 10 times better than 80V silicon MOSFETs. This enables switching frequencies that are 10 times
higher than silicon MOSFETs and without an efficiency penalty, thus producing the highest power density. This makes the EPC2619 ideal for high frequency hard-switching 24V – 48V applications, such as used in buck, buck-boost, and boost converters.
Magnachip unveils power management IC optimised for OLED IT devices
M Using I2
agnachip Semiconductor Corporation has launched its first Power Management Integrated Circuit (PMIC) for OLED screens. C it can control functions such as output
voltage control, ON/OFF block, output voltage sequence management, protection circuit fault flag, and switching frequency transition. The fast transient response supports a variable refresh rate, enabling a screen to adjust how often it
refreshes the image to match the frame rate without user input. This reduces power consumption and enables a smooth viewing experience at refresh rates of 60Hz~240Hz. Additionally, the power circuit can be simple and compact. This new IC incorporates one boost
regulator for the power supply to source and gate drivers, one low dropout (LDO) regulator, two voltage reference operational amplifiers, three negative output LDO regulators, three high-current buck regulators for power supply to a timing controller and two operational amplifiers for the gamma buffer. This level of integration results in smaller and faster electronic circuits. Engineered with strong circuit protection, this PMIC also provides over-voltage protection, short circuit protection, thermal shutdown, under voltage lockout, over current detection, over current shutdown and clamping circuit. Omdia, a global market research firm, estimates that the OLED panel shipments for laptops will
grow 44.3% annually from 6.3 million substrates in 2022 to 39.2 million substrates by 2027. The research firm also expects that OLED panels for tablet PCs will be shipped from 3.9 million substrates this year to 24.2 million substrates in 2027. “The expansion of OLED applications in IT devices is expected to continue,” said YJ Kim, CEO of Magnachip. “Magnachip will extend its premium PMIC product line through technological validation
for a wide range of IT applications to address changing market demand and design requirements.”
www.magnachip.com
New from Hylec: The DIME clip-together DIN rail support system DIME modules suit 72mm width PCBs and
of modules is an open front system that provides DIN rail support for PCBs between 20mm and 177.5mm in length, with longer lengths possible by adding additional base mounting elements.
H
ylec-APL has launched a push- together range of PCB housing modules called DIME. The DIME range
are easy to assemble enabled by the push- fit mechanism. There are several modules in the DIME range: BE base sections, which are available in three widths: 11.35mm, 22.5mm and 45mm; SEF end sections with feet (DIN Clips), available in two widths: 11.25 and 22.5mm; SE end sections without feet, also
available in two widths: 11.25 and 22.5mm; FS foot elements, to be clipped to SE and BE Sections. The SEF end sections with feet cut assembly time and reduce the number of stock lines that need to be carried. These sections only suit a top hat style DIN rail, but the FS foot elements fit both G and top hat rails.
www.hylec-apl.com
8 NOVEMBER 2022 | ELECTRONICS TODAY
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