search.noResults

search.searching

saml.title
dataCollection.invalidEmail
note.createNoteMessage

search.noResults

search.searching

orderForm.title

orderForm.productCode
orderForm.description
orderForm.quantity
orderForm.itemPrice
orderForm.price
orderForm.totalPrice
orderForm.deliveryDetails.billingAddress
orderForm.deliveryDetails.deliveryAddress
orderForm.noItems
INTEGRATED MONITORED PXI MULTIPLEXER MODULE FROM PICKERING P


ickering Interfaces has released a new range of PXI multiplexer


modules (model 40-619) to help monitor the open status of any channel. The 40-619 performs the same as a typical single-pole, 2A 60W multiplexer but uses secondary relays to determine the multiplexer channel status. Every multiplexer channel is provided with an additional monitor switch that allows the user, via an external measurement device, to verify that


multiplexer channels are ‘open’ before applying test signals. This feature is essential in applications where the incorrect or unintended application of signals may damage the device-under-test. The 40-619 is available in nine


switching configurations from 16:1 to 128:1. It uses high-quality electro-mechanical (EMR) signal relays suitable for switching loads up to 2A at 250VAC/DC. The compact, single-slot footprint


permits the implementation of a monitoring function while minimising chassis slot space. The modules are supported by


Pickering’s eBIRST diagnostic test tool. Like all Pickering’s products, the 40-619 monitored multiplexer modules carry a three-year warranty and come with spare relays that allow customers with appropriate training to do repairs on-site, minimising system downtime. www.pickeringtest.com


Want to keep up to date? Then follow us on Twitter: @ CI_ Electronics and/or ‘Like’ us on Facebook!


X-FAB AND IHP TO PROGRESS SIGE BICMOS TECHNOLOGY


inductors and transformers. This integration will mean that a wide array of next generation wireless systems concepts can be experimented with. Another key focus for the collaborative work


that has been conducted is the development of advanced SiGe BiCMOS technologies. At the


X-FAB Silicon Foundries and IHP - Leibniz Institute for High Performance Microelectronics have announced a major industry-academic partnership. IHP’s active devices will be directly integrated into the


backend of line (BEOL) of X-FAB’s 130nm XR013 RF-SOI process featuring Cu and thick-Cu based metallisation, alongside high-performance passive elements, such as


foundation of this will be IHP’s SiGe heterojunction bipolar transistors. These offer strong performance parameters, with fT/fmax figures of up to 250/340 GHz for SG13S-Cu and up to 300/500GHz for SG13G2-Cu. The 3µm thick low-loss copper interconnects employed are also certain to prove valuable in helping to boost RF performance levels. www.xfab.com


TIMEPROVIDER 4100 RELEASE 2.2 I


n the March issue top feature focuses include the dynamic


world of automotive electronics with a look at how digital twins can improve efficiency of electric cars on p8. We also have a focus on obsolescence and how to manage these challenges on p10. On p12 we explores the capabilities of a synchronous buck-boost controller. In our wearables focus we look at ensuring compliance for devices in this sector on p14. In our cover story on p16 we consider a Peel-A-Way Removable Terminal Carrier, whilst our enclosure feature on p18 focuses on configuration. Michelle Winny Editor


4 MARCH 2021 | ELECTRONICS


2.2 grandmaster provides redundancy via software implementation, enabling flexible deployment and lower hardware costs without sacrificing ports. In addition, the TimeProvider 4100


Microchip Technology Inc.’s TimeProvider 4100 Release 2.2 grandmaster, provides a new level of resiliency with the introduction of an innovative redundancy architecture. In addition support for a multiband Global Navigation Satellite System (GNSS) receiver and enhanced security to ensure always-on precise timing and synchronisation is also offered Redundancy is key for infrastructure


providers to ensure uninterrupted services. Infrastructure deployments previously relied on hardware redundancy to avoid service disruption despite costly modular architectures. Microchip’s TimeProvider 4100 Release


Release 2.2 grandmaster introduces an increased level of resiliency by supporting a new GNSS multi-band, multi-constellation receiver to protect against time delay resulting from space weather, solar events and other disruptions that may impact critical infrastructure services. Multiband GNSS is particularly important for the highest levels of accuracy including Primary Reference Time Clock Class B (PRTC-B) (40 ns) and Enhanced Primary Reference Time Clock (ePRTC) (30 ns). With a focus on security solutions


across its technology portfolio, Microchip’s new TimeProvider 4100 Release 2.2 grandmaster adds support for RADIUS and TACACS+ as well as new anti-jamming and anti-spoofing capabilities. www.microchip.com


Bridgetek’s new ME817EV evaluation board features the company’s BT817 embedded video engine (EVE) device, which allows engineers to experiment with the latest generation of EVE technology and get a comprehensive understanding of the breadth of its capabilities. Thanks to the higher resolutions and large format displays that the BT817 supports, more compelling and functionality-rich HMIs can be created, with greater visual clarity and enhanced video playback capabilities.


www.brtchip.com


AMD’s new AMD EPYC 7003 Series CPUs includes the AMD EPYC 7763, a high-performing server processor. The new EPYC 7003 series processors help HPC, cloud and enterprise customers do more, faster, by delivering the best performance of any server CPU with up to 19% more instructions per clock.


www.amd.com


PCB layouts are typically drafted, developed and realised with the help of digital parts libraries used within Autodesk Fusion 360. The purpose of these parts libraries is to help designers create electric circuits, place components on the PCB or conceive the board routing. Libraries are most useful when they are complete. To simplify the design process, Panasonic Industry has now made available almost all its relay families (including PhotoMOS) as Fusion 360 parts libraries. Most components are contained as 2D, and some as 3D data. The range of details contained in the digital models of relays includes core specifications such as switching current, switching voltage, contact arrangement, and different sizes. Having in mind that relays do not have a standard layout, the libraries will provide designers an extraordinary benefit by helping identify the best choice for electronic circuits and their design.


www.panasonic.com / ELECTRONICS


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46