PODUCTS POWER ELECTRONICS
OPEN SOURCE POWER DELIVERY SOFTWARE ENABLES CODE INTEGRATION FOR USB SYSTEM DIFFERENTIATION
product offerings while choosing from a wide variety of Microchip SmartHubs, microcontrollers (MCUs) and standalone PD solutions for their USB systems. Microchip’s PSF
solution offers both an open-source code base for power delivery and a comprehensive programming environment,
U
SB Type-C with Power Delivery (PD) and open source software are two technologies leading
the next wave of wired connectivity. With Microchip Technology Inc.’s new Power Delivery Software Framework (PSF), designers can now modify and own the IP in their USB-C PD systems. By merging their proprietary code with Microchip’s fully functionable PD stack, designers have the ultimate flexibility for creating differentiated
removing the need for manufacturer dependence and making it easy for users to program MCUs and immediately modify PD code as their system evolves. Customers can now determine their own product destiny, reducing time to market and overall bill of materials (BOM). Using both a software and hardware framework,
developers can also choose from an expanded family of Microchip controller options to host PD
functionality, including the new UPD301B and UPD301C standalone PD controllers. The PD architecture’s open approach enables
customers to easily add a USB-C/PD port to a wide range of embedded applications, while also allowing them to reallocate unused pins or CPU memory to other system functions. A range of Microchip SAM and PIC MCUs and dsPIC Digital Signal Controllers (DSCs) are supported. The PSF solution gives designers the option to run PD on an existing Microchip MCU infrastructure by adding the UPD350 PD transceiver or by integrating PD into more complex product offerings with proprietary system code. “With our new PD Software Framework, all
Microchip MCUs and standalone controllers that support USB-C now share the same PD code base,” said Charles Forni, vice president of Microchip’s USB and networking business unit. “This code is provided free to customers and is
easy to configure and modify, enabling them to implement new features and system updates without the need for a manufacturer to customise the code for them. Microchip’s PSF offering changes the way USB-C PD is integrated into customer systems.”
www.microchip.com
X-FAB ENHANCES AUTOMOTIVE EMBEDDED FLASH FOR ITS 180NM HIGH-VOLTAGE CMOS TECH
assured. X-FAB’s XSTI embedded Non-Volatile Memory (NVM) IP test interface has also been included in order to enable full serial access to the memory. As this automotive-grade Flash IP is capable of running on a single 1.8V
power supply, it is well-suited for low-power designs. The addition of a built-in-self-test (BIST) module is pivotal in enabling effective memory testing, as well as enabling comprehensive product debugging. X-FAB is also able to provide a full NVM test service to customers if required. “This new IP solution further enriches X-FAB’s embedded Flash portfolio
X-FAB Silicon Foundries has introduced a new Flash memory capability for its XP018 high-voltage automotive process. This new Flash IP uses the company’s Silicon Oxide Nitride Oxide Silicon (SONOS) technology. Fully compliant with stringent AEC100-grade 0 automotive specification, it can withstand operation across a -40°C to 175°C temperature range and fully supports the functional safety levels specified by ISO 26262. It is supplied in a 32 KByte array size, following an 8K x 39-bit
configuration, with a 32-bit data bus. A further seven bits are dedicated to Error Code Correction (ECC) so that zero-defect reliability in the field is
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for 180nm open technology platforms, which come with a large selection of voltages and wafer materials. This strengthens our offering to the market, allowing us to meet customer demands across a wider variety of applications,” states Thomas Ramsch, Director NVM Development at X- FAB. “It will be of particular value in situations where both low-power and resilience to challenging conditions are expected.” “By being able to complement existing X-FAB platforms with new
embedded Flash capabilities, enables significant reductions in footprint. Also, the modular approach of XP018 means that fewer mask layers are going to be needed, adds Nando Basile, Technology Marketing Manager for NVM solutions at X-FAB. “The new Flash IP means that XP018 is now able to address mixed-
signal, high-voltage applications where additional logic content and computational resources are required in a highly cost-effective way.
www.xfab.com
APRIL 2021 | ELECTRONICS / ELECTRONICS
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