DualPack3 Power Density, Simplified for You Cost-Efficient Performance in Industry-Standard Packaging


The new DualPack3 modules with IGBT7 technology deliver power density, cost efficiency and robust performance in a compact, proven package. Available in 300–900A ratings at 1200V and 1700V, DualPack3 is built for today’s demanding applications.


Key Features • High power density in a smaller footprint • Up to 20% reduced losses vs. IGBT4 • Compact 152 × 62 × 20 mm package size • Higher current output without paralleling modules • Simplified gate driving with precise dV/dt control • Reliable operation up to 175°C overload temperature • Supply chain security with multi-supplier support


Discover how DualPack3 can power your next design.


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Incorporated in the U.S.A. and other countries. All other trademarks are the property of their registered owners. © 2025 Microchip Technology Inc. All rights reserved. MEC2632A-UK-11-25


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