NEWS


 Hybrid Bonding


Advanced Scanning Acoustic Microscopy equipment detects   


T


oday, hybrid bonding is transforming the semiconductor industry by facilitating the production of increasingly intricate,   intelligence, high-performance computing 


Hybrid bonding is quickly gaining recognition due to the enhanced reliability and mechanical strength of its interconnects,     spaced copper pads, bonding the dielectric and metal bond pads simultaneously in a 


       bonding facilitates heterogeneous integration, enabling semiconductor companies to   


    


The concept behind three-dimensional         become increasingly complex, so do the    


Figure 1: Scanning Acoustic Microscopy (SAM) is a non-invasive and non-destructive ultrasonic testing method that is quickly becoming the preferred technique for testing and failure analysis involving stacked dies or wafers.





  testing method that is quickly becoming the preferred technique for testing and failure     The resulting acoustic signatures can be constructed into 3-dimensional images that are analysed to detect and characterise    


 100 percent inspection of semiconductor components to identify defects such as   adapted to facilitate 100 percent inspection of 


    


Figure 2: SAM utilises ultrasound waves to non-destructively examine internal structures, interfaces and surfaces of opaque substrates


Figure 3: SAM is already the industry standard for 100 percent inspection of semiconductor compon- ents to identify defects such as voids, cracks and delamination within microelectronic devices.


6 SEPTEMBER 2024 | ELECTRONICS FOR ENGINEERS


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