search.noResults

search.searching

saml.title
dataCollection.invalidEmail
note.createNoteMessage

search.noResults

search.searching

orderForm.title

orderForm.productCode
orderForm.description
orderForm.quantity
orderForm.itemPrice
orderForm.price
orderForm.totalPrice
orderForm.deliveryDetails.billingAddress
orderForm.deliveryDetails.deliveryAddress
orderForm.noItems
www.efemag.co.uk E www.efemag.co.uk E


IN THIS ISSUE • Enclosures • Supply Chain • Microelectronics UK


1 E4E Cover.indd 1 NGINEERS LECTRONICS FOR July/August 2026


Designed, engineered, printed


healthcare


• Medical Electronics • Test & Measurement • Artificial Intelligence


26/08/2026 15:17


NGINEERS T


LECTRONICS FOR July/August 2026 In this issue


he distal tip of a single-use ureteroscope is smaller than a grain of rice. Inside it, engineers must house a camera chip and an illumination source, contain and seal both elements with a high degree of precision, integrate irrigation channels and seal the entire assembly against fluid ingress - all within a diameter of just 3.302 mm. That profile demands complex 3D geometry, tight tolerances and wall thicknesses that push traditional production processes to their absolute limits. It is a precise, unforgiving constraint and it is far from unique... Read more on Page 30


Contents Editor’s Comment & News


6 A guide to avalanche photodiode sensor terminology


8 How intelligent actuators and edge AI are transforming vehicle technology


10 The defence production surge 12 The solder joint that passes the test and still fails


Features


Enclosures 18 Smarter security for enclosures: How electronic access is transforming enclosure protection


19 Diecast aluminium enclosures for terminal electronics: Specification beyond protection


Artificial Intelligence 20 What challenges does AI face in the physical world?


22 Power system resilience in data centres 23 Scaling AI in Europe: The critical role of data centre power, cooling and monitoring 24 From road to rack


Test & Measurement 26 Proven by design: Why design for test defines reliable ASIC development


28 Proven by design: Why design for test defines reliable ASIC development


Medical Electronics 30 Building the impossible: How micro 3D printing is engineering the next frontier in medical electronics


32 How high-performance computing platforms are advancing optical coherence tomography in ophthalmic diagnostics


34 Highly reliable electronic components drive medical innovations


Supply Chain 36 Ensuring cybersecurity along the supply chain 38 How decision intelligence transforms supply chain risk response


Scan the QR code above to subscribe to


Electronics For Engineers


JULY/AUGUST 2026 | ELECTRONICS FOR ENGINEERS


3


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46